LFE5U-25F-8BG381C

IC FPGA 197 I/O 381CABGA
Part Description

ECP5 Field Programmable Gate Array (FPGA) IC 197 1032192 24000 381-FBGA

Quantity 201 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package381-CABGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case381-FBGANumber of I/O197Voltage1.045 V - 1.155 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs6000Number of Logic Elements/Cells24000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits1032192

Overview of LFE5U-25F-8BG381C – ECP5 FPGA, 24k logic elements, 381‑FBGA

The LFE5U-25F-8BG381C is a field‑programmable gate array (FPGA) from Lattice Semiconductor’s ECP5 family. It provides a balanced combination of programmable logic, embedded memory, and high I/O count for compact system designs.

With 24,000 logic elements, approximately 1.03 Mbits of embedded RAM, and 197 general‑purpose I/Os delivered in a 381‑FBGA (17×17) package, this device is suited to applications that require flexible logic integration, on‑chip memory, and dense I/O routing in a commercial‑grade FPGA.

Key Features

  • Core Logic 24,000 logic elements and 6,000 CLBs provide substantial programmable logic capacity for glue logic, protocol handling, and control functions.
  • Embedded Memory Approximately 1.03 Mbits of on‑chip RAM for frame buffering, FIFOs, and local data storage.
  • High I/O Count 197 user I/Os enable wide parallel interfaces and multiple peripheral connections.
  • Package and Mounting 381‑FBGA package (supplier package: 381‑CABGA, 17×17) in a surface‑mount form factor for compact PCB implementation.
  • Power Supply Core supply operating range from 1.045 V to 1.155 V for precise power domain control.
  • Operating Temperature & Grade Commercial‑grade device rated for 0 °C to 85 °C operation.
  • Standards & Compliance RoHS‑compliant to meet common environmental and manufacturing requirements.
  • ECP5 Family Architecture (from datasheet) Documented ECP5 family architecture including PFU blocks, clocking structure, memory and DSP slices, SERDES, and programmable I/O resources.

Typical Applications

  • High‑density logic integration — Implements glue logic, control state machines, and custom bus bridging where up to 24,000 logic elements are required.
  • Serial and memory interfaces — Supports designs that leverage the ECP5 family’s documented SERDES and DDR memory support for high‑speed link and memory interfacing.
  • Embedded buffering and data paths — Uses approximately 1.03 Mbits of on‑chip RAM for FIFOs, packet buffering, and small local memory needs.
  • I/O‑intensive systems — 197 I/Os enable dense peripheral connectivity, multi‑lane interfaces, and parallel sensor or actuator buses.

Unique Advantages

  • Balanced logic and memory — Combines 24,000 logic elements with ~1.03 Mbits of embedded RAM for mixed control and data‑path functions.
  • High I/O density in a compact package — 197 I/Os in a 381‑FBGA (17×17) make it suitable for space‑constrained PCBs that still require many external connections.
  • Family‑level architecture detail — ECP5 datasheet coverage of clocking, DSP slices, SERDES, and programmable I/O helps in-depth design planning and verification.
  • Precise core voltage window — Narrow supply range (1.045 V–1.155 V) supports stable core operation when adhering to recommended power design.
  • Commercial temperature rating — Specified 0 °C to 85 °C range for general embedded and industrial control applications within commercial environments.
  • RoHS‑compliant — Meets common environmental regulatory requirements for modern manufacturing.

Why Choose LFE5U-25F-8BG381C?

The LFE5U-25F-8BG381C positions itself as a compact, capable member of the Lattice ECP5 family, offering a combination of 24,000 logic elements, significant on‑chip RAM, and a high I/O count in a 381‑FBGA package. Its documented family architecture—covering routing, clocking, DSP, SERDES, and memory—supports methodical design and integration.

This part is well suited for designers who need a mid‑density FPGA with substantial I/O and embedded memory for control, interfacing, and data buffering tasks in commercial‑grade systems. The device’s clear electrical and thermal parameters simplify system power and thermal planning, while RoHS compliance aligns with common manufacturing requirements.

If you would like pricing, availability, or to request a quote for LFE5U-25F-8BG381C, submit a product inquiry or request a quote through your preferred procurement channel.

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