LFE5U-25F-8MG285C
| Part Description |
ECP5 Field Programmable Gate Array (FPGA) IC 118 1032192 24000 285-LFBGA, CSPBGA |
|---|---|
| Quantity | 517 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 285-CSFBGA (10x10) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 285-LFBGA, CSPBGA | Number of I/O | 118 | Voltage | 1.045 V - 1.155 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 6000 | Number of Logic Elements/Cells | 24000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1032192 |
Overview of LFE5U-25F-8MG285C – ECP5 Field Programmable Gate Array (FPGA) IC, 24,000 logic elements, 285-LFBGA
The LFE5U-25F-8MG285C is an ECP5 family FPGA from Lattice Semiconductor Corporation. It provides a mid-density, programmable logic fabric with 24,000 logic elements and approximately 1.03 Mbits of embedded memory, designed for commercial-temperature embedded applications.
Built around the ECP5 architecture, the device includes programmable I/O, SERDES and DDR memory support, dedicated DSP resources and flexible clocking and configuration features, making it suitable for applications that require moderate logic density, compact BGA packaging, and low-voltage operation.
Key Features
- Core Logic — 24,000 logic elements for implementing combinational and sequential logic functions in a compact FPGA footprint.
- Embedded Memory — Approximately 1.03 Mbits (1,032,192 bits) of on-chip RAM, with support in the family for single, dual and pseudo-dual port memory modes and memory cascading.
- Programmable I/O & Interfaces — 118 user I/Os with programmable I/O cell architecture; family-level support for DDR memory interfaces, SERDES blocks and a physical coding sublayer is included in the datasheet.
- DSP and Data Path — sysDSP™ slice architecture described in the ECP5 family datasheet provides dedicated resources for arithmetic and signal processing functions.
- Clocking & Timing — Integrated clocking features such as sysCLOCK PLLs, clock distribution network and clock dividers are part of the ECP5 family architecture.
- Configuration & System Features — Family-level device configuration options include on-chip oscillator, IEEE 1149.1-compliant boundary scan testability and single event upset (SEU) support described in the datasheet.
- Power & Voltage — Operates from a core supply range of 1.045 V to 1.155 V, enabling low-voltage system designs.
- Package & Mounting — 285-LFBGA (285-CSFBGA, 10×10) package, surface-mount mounting type for compact board-level integration.
- Temperature & Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C.
- Compliance — RoHS compliant.
Typical Applications
- High-speed serial interfaces — Use the device’s SERDES and programmable I/O capabilities to implement serial link endpoints and protocol bridging.
- Memory interface and bridging — DDR memory support and on-chip memory modes enable use as a memory controller or interface bridge in embedded systems.
- DSP and signal processing — sysDSP slice resources and embedded RAM support data path acceleration for filtering, encoding/decoding and other arithmetic-heavy tasks.
- Embedded control and glue logic — Adequate logic density and 118 I/Os make the device suitable for consolidating multiple glue-logic functions and control interfaces in a single package.
Unique Advantages
- Highly integrated mid-density FPGA — 24,000 logic elements combined with ~1.03 Mbits of embedded RAM reduce external component count and simplify board-level design.
- Flexible I/O and serial capability — Programmable I/O cells, SERDES and DDR support enable diverse interface implementations without discrete PHYs.
- Low-voltage core operation — Core supply range of 1.045 V to 1.155 V supports low-power design strategies and modern system rails.
- Compact BGA packaging — 285-LFBGA (10×10) package provides a space-efficient footprint for dense PCB layouts.
- Commercial-temperature suitability — Specified operating range of 0 °C to 85 °C fits a broad set of commercial embedded applications.
- Standards and system features from ECP5 family — Family-documented features such as PLLs, on-chip oscillator, boundary scan and SEU support assist system integration and testability.
Why Choose LFE5U-25F-8MG285C?
The LFE5U-25F-8MG285C positions itself as a versatile mid-density FPGA option for designers who need a balance of logic capacity, embedded memory and interface flexibility in a compact BGA package. With 24,000 logic elements, approximately 1.03 Mbits of RAM and 118 I/Os, it is well suited for embedded control, interface bridging, DSP acceleration and serial communication tasks within commercial-temperature systems.
As part of the ECP5 family, this device aligns with the documented architecture and system features in the family datasheet—providing configurable clocking, DSP slices, SERDES and memory options that support scalable designs and implementation reuse across the family.
Request a quote or submit an inquiry to purchase the LFE5U-25F-8MG285C and receive pricing and availability information for your design needs.