LFE5UM5G-45F-8BG554C

The LFE5UM5G-45F-8BG554C is a commercial-grade Field Programmable Gate Array (FPGA) IC from the Lattice ECP5-5G family. It delivers a balance of logic capacity, embedded memory and a high I/O count in a compact 554-CABGA (23 × 23) package for surface-mount applications.

With 44,000 logic elements, approximately 1.99 Mbits of on-chip RAM and 245 user I/Os, this device targets commercial embedded designs that require moderate logic density, flexible I/O and family-level communications and timing features described in the ECP5-5G datasheet.

Key Features

• Core Logic
  Provides 44,000 logic elements suitable for complex glue logic, protocol bridging and mid-density FPGA tasks.
• On-chip Memory
  Approximately 1.99 Mbits of embedded RAM for frame buffers, FIFOs and local working storage.
• I/O and Packaging
  245 programmable user I/Os in a 554-CABGA (23 × 23) 554-FBGA package, optimized for dense board-level connectivity and surface-mount assembly.
• Power
  Nominal core supply range 1.045 V to 1.155 V to support the device core rails as specified.
• Operating Conditions
  Commercial temperature range from 0 °C to 85 °C; grade specified as Commercial.
• Family-level Architecture
  Part of the ECP5-5G family; datasheet describes architecture elements such as programmable I/O cells, sysDSP slices, SERDES and clocking resources (sysCLOCK PLL, clock distribution and DDR support).
• Surface Mount and Compliance
  Surface mount package with RoHS compliance for standard commercial manufacturing processes.

Typical Applications

• Connectivity & Protocol Bridging
  High I/O count and family SERDES/PCS support make this device suitable for protocol conversion, interface bridging and I/O expansion modules.
• Embedded Processing & DSP Acceleration
  On-chip RAM and sysDSP slice functionality (described in the ECP5-5G family datasheet) support local buffering and signal processing tasks.
• Memory Interface Designs
  Datasheet-level DDR memory support and DQS calibration features enable implementation of external memory interfaces and controllers.
• Custom Control & Glue Logic
  44,000 logic elements and abundant I/Os are suitable for control logic, timing-critical glue logic and peripheral aggregation in commercial systems.

Unique Advantages

• Substantial Logic Capacity: 44,000 logic elements provide the resources needed for mid-density FPGA implementations without external programmable logic.
• Embedded Memory: Approximately 1.99 Mbits of on-chip RAM reduces reliance on external memory for many buffering and storage tasks.
• High I/O Count in a Compact Package: 245 I/Os in a 554-CABGA (23 × 23) package support dense connectivity while maintaining a small board footprint.
• Comprehensive Family Architecture: ECP5-5G family features such as programmable I/O cells, clock management (PLL and distribution), sysDSP slices and SERDES capabilities provide architectural flexibility described in the datasheet.
• Commercial Manufacturing Compatibility: Surface-mount package and RoHS compliance align with standard commercial production workflows.
• Defined Operating Range: Specified core voltage (1.045 V–1.155 V) and commercial temperature range (0 °C–85 °C) allow designers to account for supply and thermal requirements precisely.

Why Choose LFE5UM5G-45F-8BG554C?

The LFE5UM5G-45F-8BG554C combines a mid-density logic fabric, nearly 2 Mbits of on-chip RAM and a high I/O count in a compact 554-CABGA package, making it well suited for commercial embedded designs that need a balance of logic, memory and connectivity. As a member of the ECP5-5G family, it benefits from documented architecture elements—programmable I/Os, sysDSP resources, SERDES and comprehensive clocking—which designers can reference directly in the family datasheet.

This part is appropriate for product teams building commercial-grade connectivity modules, protocol converters, embedded controllers and DSP-accelerated functions where package size, I/O density and integrated memory are key selection criteria.

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