LFE5UM5G-45F-8BG554I

The LFE5UM5G-45F-8BG554I is a field programmable gate array (FPGA) device in the ECP5-5G family from Lattice Semiconductor. It provides a programmable fabric with 44,000 logic elements, a large I/O count, and on-chip embedded memory, delivered in a 554‑FBGA package.

This device is specified for industrial temperature operation and RoHS-compliant manufacturing, with detailed architecture elements and system features described in the ECP5/ECP5-5G family data sheet.

Key Features

• Logic Capacity — 44,000 logic elements (logic element cells) for complex programmable logic implementations.
• Embedded Memory — Approximately 2.0 Mbits of on-chip RAM (1,990,656 bits) to support buffering, state storage, and local data processing.
• I/O Resources — 245 I/O pins with programmable I/O cell structures described in the family data sheet for flexible interfacing.
• Clocking and Timing — Family-level architecture includes sysCLOCK PLL, clock distribution network, clock dividers and DDRDLL support for refined clock control (see datasheet for full details).
• High-Speed Interfaces — Family documentation covers SERDES and Physical Coding Sublayer blocks and a flexible dual SERDES architecture for serialized data links.
• DSP and Memory Blocks — sysDSP slices and sysMEM memory blocks are part of the family architecture for on-chip signal processing and memory configurations.
• Configuration and Reliability — Device configuration features in the family include boundary-scan testability, Single Event Upset (SEU) support, and an on-chip oscillator (refer to the datasheet for details).
• Package & Mounting — 554‑FBGA (554‑CABGA) package in a 23×23 mm footprint; surface-mount assembly.
• Power — Core supply operating range specified at 1.045 V to 1.155 V.
• Temperature and Grade — Industrial-grade device with operating temperature range of −40 °C to 100 °C.
• Regulatory — RoHS compliant.

Typical Applications

• Programmable Logic Systems — Use as a reconfigurable logic fabric where up to 44,000 logic elements and embedded RAM are required for custom logic implementations.
• High‑I/O Interfaces — Ideal for designs that require large I/O counts and programmable I/O cell functionality to match diverse external interfaces.
• On‑Chip Memory and DSP — Suitable for applications leveraging the device family’s sysMEM and sysDSP resources for local buffering and signal processing.

Unique Advantages

• High Logic Density: 44,000 logic elements provide substantial capacity for mid-range FPGA designs without external logic chips.
• Integrated On‑Chip Memory: Approximately 2.0 Mbits of embedded RAM reduces the need for external memory in many buffering and storage tasks.
• Generous I/O Resources: 245 I/O pins with programmable I/O cells enable flexible interfacing to peripherals and external systems.
• Industrial Temperature Range: −40 °C to 100 °C rating supports deployment in temperature-challenging environments.
• Compact, Surface‑Mount Package: 554‑FBGA (23×23 mm) offers a high pin-count in a compact surface-mount form factor for space-constrained boards.
• Standards and Compliance: RoHS compliance supports environmentally conscious manufacturing and supply chain requirements.

Why Choose LFE5UM5G-45F-8BG554I?

The LFE5UM5G-45F-8BG554I combines substantial programmable logic capacity, embedded memory, and a high I/O count in a compact 554‑FBGA package. Its family-level architecture includes advanced clocking, SERDES, DSP and memory block features that make it a versatile choice where on-chip resources and flexible interfacing are priorities. The device’s industrial temperature rating and RoHS compliance further support robust, production-ready deployments.

This part is appropriate for engineers and procurement teams specifying mid-range FPGA capacity with integrated memory and a broad set of device-level features documented in the ECP5/ECP5-5G family data sheet.

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