LFEC1E-3T144I

IC FPGA 97 I/O 144TQFP
Part Description

EC Field Programmable Gate Array (FPGA) IC 97 18432 1500 144-LQFP

Quantity 79 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case144-LQFPNumber of I/O97Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs192Number of Logic Elements/Cells1500
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits18432

Overview of LFEC1E-3T144I – EC Field Programmable Gate Array (FPGA) IC 97 18432 1500 144-LQFP

The LFEC1E-3T144I is a field programmable gate array (FPGA) device from Lattice Semiconductor Corporation offering a compact, surface-mount solution with moderate logic density and embedded RAM. It provides 1,500 logic elements, 18,432 bits of on-chip RAM and 97 general-purpose I/Os, making it suitable for embedded designs that require configurable logic and significant I/O count within an industrial temperature range.

Designed for assembly in a 144-pin LQFP package, this industrial-grade FPGA supports a core voltage supply range of 1.14 V to 1.26 V and operates across −40 °C to 100 °C, aligning it with applications that demand reliable operation in extended temperature environments.

Key Features

  • Logic Resources  Provides 1,500 logic elements to implement medium-density combinational and sequential logic functions.
  • Embedded Memory  Includes 18,432 bits of on-chip RAM for buffering, small FIFOs, and state storage within the FPGA fabric.
  • I/O Count  Offers 97 general-purpose I/Os for interfacing with sensors, peripherals, and external devices.
  • Power  Core voltage supply range of 1.14 V to 1.26 V to match system power domains and design constraints.
  • Package & Mounting  Surface-mount 144-LQFP package; supplier device package listed as 144-TQFP (20x20), enabling compact PCB layouts.
  • Industrial Temperature Range  Qualified to operate from −40 °C to 100 °C for deployment in temperature-challenging environments.
  • Compliance  RoHS compliant to support environmentally conscious manufacturing and supply chain requirements.

Typical Applications

  • Industrial Control  Use the device's 97 I/Os and industrial temperature rating to implement sensor interfacing, discrete I/O aggregation, and control logic in industrial systems.
  • Embedded Logic and Glue  Leverage 1,500 logic elements and embedded RAM for glue logic, protocol bridging, and custom peripheral control in embedded systems.
  • Prototyping and Development  Suitable for developers needing a programmable platform with moderate resources for early-stage hardware validation and proof-of-concept designs.

Unique Advantages

  • Balanced resource profile: 1,500 logic elements combined with 18,432 bits of RAM and 97 I/Os provide a practical mix of logic, memory, and interfacing capability for many mid-range applications.
  • Industrial-grade operation: Rated from −40 °C to 100 °C to support deployments in harsher temperature environments where extended temperature tolerance is required.
  • Compact, surface-mount package: The 144-LQFP form factor (supplier package 144-TQFP (20x20)) enables dense PCB integration and automated assembly.
  • Low-voltage core: Core supply range of 1.14 V to 1.26 V for compatibility with modern low-voltage system power rails.
  • Environmentally compliant: RoHS compliance helps meet regulatory and manufacturing requirements for reduced hazardous substances.

Why Choose LFEC1E-3T144I?

The LFEC1E-3T144I delivers a practical combination of logic capacity, embedded memory, and a high I/O count in a compact, industrial-temperature package from Lattice Semiconductor Corporation. Its specifications make it well suited for engineers seeking a configurable mid-density FPGA for embedded control, I/O aggregation, and prototyping tasks where reliability across a wide temperature range is important.

This device is appropriate for designs that require a balance between integration and footprint, offering predictable power and environmental characteristics that simplify system-level planning and component selection.

Request a quote or submit an inquiry to receive pricing and availability information for the LFEC1E-3T144I.

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