LFEC1E-3TN144I

IC FPGA 97 I/O 144TQFP
Part Description

EC Field Programmable Gate Array (FPGA) IC 97 18432 1500 144-LQFP

Quantity 254 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package144-TQFP (20x20)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case144-LQFPNumber of I/O97Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs192Number of Logic Elements/Cells1500
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits18432

Overview of LFEC1E-3TN144I – EC Field Programmable Gate Array (FPGA) IC 97 18432 1500 144-LQFP

The LFEC1E-3TN144I is a Lattice Semiconductor EC-family FPGA delivered in a 144-pin LQFP/TQFP package. It provides a compact, industrial-grade programmable logic solution with 1,500 logic elements, 97 I/O pins and 18,432 bits of on-chip RAM for density-optimized embedded designs.

Designed for mainstream embedded and industrial applications, this device delivers a low-voltage core (1.14 V to 1.26 V), surface-mount 144-pin package, and an extended operating range from −40 °C to 100 °C to meet harsh-environment deployment needs.

Key Features

  • Logic Capacity  Approximately 1,500 logic elements suitable for small to mid-size FPGA implementations and control logic.
  • On-chip Memory  18,432 bits of total RAM available for distributed and embedded memory requirements.
  • I/O Density  97 general-purpose I/Os in the 144-pin package support multiple parallel interfaces and peripheral connectivity.
  • Package & Mounting  Surface-mount 144-LQFP package (supplier device package: 144-TQFP, 20×20 mm) for compact PCB layouts.
  • Power  Core supply range from 1.14 V to 1.26 V to match system power rails and design constraints.
  • Industrial Temperature Range  Rated for operation from −40 °C to 100 °C for reliable performance in industrial environments.
  • RoHS Compliant  Manufactured to meet RoHS requirements for regulatory and environmental compliance.

Typical Applications

  • Industrial Control  Use the LFEC1E-3TN144I for machine control, PLC logic expansion and I/O aggregation where extended temperature range and industrial-grade components are required.
  • Embedded Systems  Ideal for small to mid-size embedded applications that require programmable logic, on-chip memory and flexible I/O in a compact package.
  • Communications Interfaces  Implement protocol bridging, glue logic and peripheral interfaces using the device’s 97 I/Os and on-chip resources.
  • Instrumentation & Test  Integrate custom timing, control and signal-conditioning logic into test equipment and measurement systems operating across wide temperatures.

Unique Advantages

  • Compact, high-density package: The 144-LQFP (144-TQFP 20×20 mm) lets you integrate programmable logic without a large PCB footprint.
  • Right-sized logic and memory: ~1,500 logic elements and 18,432 bits of RAM balance capacity and cost for mainstream FPGA functions.
  • Extensive I/O count: 97 available I/Os simplify board-level integration of sensors, actuators and communication peripherals.
  • Industrial-grade operation: Rated from −40 °C to 100 °C to support deployment in demanding environments.
  • Low-voltage core: 1.14 V to 1.26 V supply range supports modern low-voltage system architectures.
  • RoHS compliant manufacturing: Helps meet environmental and regulatory requirements for commercial products.

Why Choose LFEC1E-3TN144I?

The LFEC1E-3TN144I sits within the LatticeECP/EC family as a cost-optimized FPGA option that delivers practical logic density, on-chip RAM and a substantial I/O count in a compact, surface-mount 144-pin package. Its industrial temperature rating and RoHS compliance make it suitable for long-lived embedded and industrial applications that require reliable programmable logic without unnecessary overhead.

This device is well-suited to engineers and procurement teams building control, interface and embedded designs that need a balance of integration, I/O flexibility and environmental robustness while keeping board area and system power in check.

Request a quote or submit an inquiry today for pricing and availability of LFEC1E-3TN144I.

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