LFEC1E-5Q208C

IC FPGA 112 I/O 208QFP
Part Description

EC Field Programmable Gate Array (FPGA) IC 112 18432 1500 208-BFQFP

Quantity 465 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 85°C
Package / Case208-BFQFPNumber of I/O112Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs192Number of Logic Elements/Cells1500
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits18432

Overview of LFEC1E-5Q208C – EC Field Programmable Gate Array (FPGA) IC 112 18432 1500 208-BFQFP

The LFEC1E-5Q208C is an EC-class field programmable gate array (FPGA) from Lattice Semiconductor Corporation designed for compact, surface-mount system integration. It provides 1,500 logic elements, 18,432 bits of embedded RAM and up to 112 I/O pins in a 208-pin BFQFP package.

With a low-voltage supply range of 1.14 V to 1.26 V and a commercial operating temperature range of 0 °C to 85 °C, this device targets space-constrained applications that require moderate logic density, on-chip memory and flexible I/O in a standard surface-mount footprint.

Key Features

  • Logic Capacity — Includes 1,500 logic elements suitable for implementing custom glue logic, state machines and small-to-moderate programmable functions.
  • Embedded Memory — Provides 18,432 bits of on-chip RAM for data buffering, small FIFOs and register storage without external memory.
  • I/O Count — Up to 112 general-purpose I/O pins to support multiple peripheral interfaces and signal routing within a compact design.
  • Power — Operates from a supply range of 1.14 V to 1.26 V, enabling integration into low-voltage systems.
  • Package and Mounting — Available in a 208-BFQFP supplier package (208-PQFP, 28×28) with surface-mount mounting for PCB-level assembly.
  • Commercial Temperature Grade — Rated for operation from 0 °C to 85 °C, suitable for standard commercial environments.
  • RoHS Compliant — Manufactured to meet RoHS environmental requirements.

Typical Applications

  • Custom Logic and Glue — Implement small-to-moderate glue logic and control functions using the 1,500 logic elements to simplify board-level integration.
  • I/O Consolidation — Use up to 112 I/Os to aggregate multiple peripheral signals and interfaces on a single device.
  • On-chip Buffering — Leverage 18,432 bits of embedded RAM for small data buffers, FIFOs or register storage without external memory.
  • Compact Surface-mount Systems — The 208-BFQFP package supports dense, surface-mount PCB layouts where board area and height are constrained.

Unique Advantages

  • Balanced Logic and Memory: Combines 1,500 logic elements with 18,432 bits of RAM to handle both control logic and localized data buffering on-chip.
  • High I/O Density in a Compact Package: 112 I/Os in a 208-BFQFP footprint reduce the need for external multiplexers and simplify routing on populated PCBs.
  • Low-Voltage Operation: 1.14 V to 1.26 V supply range allows integration into low-voltage system rails and power domains.
  • Surface-mount Ready: Supplier 208-PQFP (28×28) package and surface-mount mounting support standard manufacturing processes for compact assemblies.
  • Commercial Temperature Suitability: Rated 0 °C to 85 °C for reliable operation in typical commercial environments.
  • Environmentally Compliant: RoHS compliance aligns with regulatory and corporate environmental requirements.

Why Choose LFEC1E-5Q208C?

The LFEC1E-5Q208C positions itself as a compact, commercially rated FPGA option for designs that need a moderate amount of programmable logic, on-chip memory and substantial I/O in a surface-mount 208-pin package. Its combination of 1,500 logic elements, 18,432 bits of embedded RAM and 112 I/Os delivers a balanced integration point for control, interface and buffering tasks without adding external components.

Engineers and procurement teams targeting space- and power-conscious applications will find this device suitable for consolidating logic, reducing BOM complexity and supporting standard commercial operating ranges while remaining RoHS compliant and compatible with common PCB assembly workflows.

Request a quote or submit a purchasing inquiry to learn more about availability, pricing and lead times for the LFEC1E-5Q208C.

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