LFEC1E-5QN208C
| Part Description |
EC Field Programmable Gate Array (FPGA) IC 112 18432 1500 208-BFQFP |
|---|---|
| Quantity | 378 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 112 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 192 | Number of Logic Elements/Cells | 1500 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 18432 |
Overview of LFEC1E-5QN208C – EC Field Programmable Gate Array (FPGA) IC, 112 I/Os, 1.5K LUTs, ~18 Kbits RAM, 208-BFQFP
The LFEC1E-5QN208C is an EC-family FPGA from Lattice Semiconductor Corporation, offered in a 208-BFQFP (28 × 28 mm) surface-mount package. It provides a mid-density FPGA fabric with 1,500 logic elements and approximately 18 Kbits of on-chip RAM, targeting mainstream, cost-sensitive FPGA applications that require flexible I/O and compact packaging.
Designed as part of the LatticeECP/EC family, the device combines LUT-based logic, distributed and embedded memory, on-chip PLLs and flexible I/O support to address a wide range of embedded system requirements.
Key Features
- Logic Capacity Approximately 1,500 logic elements and 192 logic blocks, suitable for mid-density embedded logic and glue-logic tasks.
- On‑Chip Memory Total RAM bits: 18,432 (approximately 18 Kbits) of embedded memory for small data buffering and state storage.
- I/O Count & Flexibility 112 I/Os in the 208-BFQFP package; the family supports a wide range of I/O standards including LVCMOS, LVTTL, SSTL, HSTL, PCI, LVDS and others as documented for LatticeECP/EC devices.
- Clocking Includes on-chip PLLs as provided in the LatticeECP/EC family (device table indicates two PLLs for LFEC1-class devices) for clock multiplication, division and phase control.
- Dedicated Memory Interface Family-level support for dedicated DDR memory interfaces (up to DDR400 / 200 MHz) is provided in the LatticeECP/EC architecture.
- Power Supply Operates from a low-voltage core supply range of 1.14 V to 1.26 V, compatible with 1.2 V system rails.
- Package & Mounting 208-BFQFP (supplier device package: 208-PQFP, 28 × 28 mm) surface-mount package for compact PCB implementation.
- Commercial Grade Rated for commercial temperature range: 0 °C to 85 °C.
- Standards & Tools Family-level features include IEEE 1149.1 boundary scan and support via Lattice ispLEVER design tools and ispLeverCORE IP modules for streamlined design integration.
- RoHS Compliant Manufactured to meet RoHS requirements.
Typical Applications
- Embedded Control & Glue Logic Mid-density logic and I/O consolidation for controller bridges, protocol translation and system glue where compact packaging and moderate logic/RAM are required.
- Memory Interface & Buffering Implement DDR interface logic and intermediate buffering leveraging the family’s dedicated DDR support and on-chip RAM.
- Consumer & Industrial Electronics User interface control, peripheral aggregation and custom timing/logic functions in commercial-temperature devices.
- Data Path & Pre‑Processing Small-scale packet handling, signal conditioning and preprocessing tasks that benefit from programmable logic and flexible I/O.
Unique Advantages
- Right‑Sized Density: 1,500 logic elements and 192 logic blocks provide a balanced mid-range capacity for designs that need more than simple CPLDs but do not require large FPGAs.
- Flexible I/O Support: 112 I/Os and a family-level programmable sysI/O buffer support a broad set of interface standards, reducing the need for external level translators.
- Compact, Surface‑Mount Package: 208-BFQFP (28 × 28 mm) offers a compact footprint for space-constrained PCBs while keeping high I/O count accessible.
- Low‑Voltage Core: Operates around 1.2 V (1.14–1.26 V range), aligning with modern low-voltage system rails for efficient power integration.
- Design Flow & IP Support: Backed by Lattice ispLEVER tools and ispLeverCORE IP modules to accelerate implementation and reduce design time.
- Commercial Temperature & RoHS Compliance: Suitable for commercial applications and manufactured to RoHS standards for regulatory compliance.
Why Choose LFEC1E-5QN208C?
The LFEC1E-5QN208C offers a practical balance of logic density, embedded memory and I/O count in a compact 208-BFQFP package, making it well suited for mainstream, cost-sensitive embedded designs that require flexible interfacing and moderate on-chip resources. Its low-voltage core operation and family-level support for DDR interfaces and multiple I/O standards enable efficient integration into modern system architectures.
Supported by Lattice design tools and pre-built IP, this device is a solid choice for designers seeking a scalable, commercially graded FPGA solution that simplifies board-level integration while maintaining the configurability of programmable logic.
Request a quote or submit an inquiry to receive pricing, lead-time and availability information for the LFEC1E-5QN208C.

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