LFEC6E-4QN208C

IC FPGA 147 I/O 208QFP
Part Description

EC Field Programmable Gate Array (FPGA) IC 147 94208 6100 208-BFQFP

Quantity 179 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 85°C
Package / Case208-BFQFPNumber of I/O147Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs768Number of Logic Elements/Cells6100
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits94208

Overview of LFEC6E-4QN208C – EC Field Programmable Gate Array IC, 147 I/O, 6,100 Logic Elements, 208-BFQFP

The LFEC6E-4QN208C is an EC Field Programmable Gate Array (FPGA) from Lattice Semiconductor Corporation. It delivers 6,100 logic elements, 94,208 bits of on-chip RAM and 147 programmable I/O in a 208-BFQFP surface-mount package.

Designed for commercial-grade embedded designs, the device operates from a 1.14 V to 1.26 V supply and supports an operating temperature range of 0 °C to 85 °C, offering a balance of logic capacity, memory and I/O for moderate-complexity systems.

Key Features

  • Core — 6,100 logic elements provide a mid-range implemention capacity for custom logic and control functions.
  • Embedded Memory — 94,208 bits of on-chip RAM for buffering, state storage and small data structures.
  • I/O — 147 programmable I/O pins enable broad peripheral and interface connectivity.
  • Power — Operates from 1.14 V to 1.26 V, suitable for low-voltage system domains.
  • Package — Surface-mount 208-BFQFP package; supplier device package listed as 208-PQFP (28×28) for compact board-level integration.
  • Mounting & Grade — Surface mount device with commercial grade specification.
  • Operating Range — Rated for 0 °C to 85 °C operation.
  • Environmental — RoHS compliant for lead-free assembly requirements.

Typical Applications

  • Commercial embedded systems — Implement control logic and protocol handling within commercial products operating inside standard temperature ranges.
  • Interface and I/O consolidation — Use the 147 I/O pins to integrate multiple peripheral interfaces and reduce external glue logic.
  • Prototyping and development — Moderate logic and on-chip RAM capacity make the device suitable for validating and iterating embedded designs.

Unique Advantages

  • Balanced logic and memory — 6,100 logic elements paired with 94,208 bits of RAM support medium-complexity designs without excessive external memory.
  • High pin count — 147 I/O simplifies multi-interface and peripheral integration on a single device.
  • Compact surface-mount footprint — 208-BFQFP (208-PQFP, 28×28) package enables dense PCB layouts and straightforward assembly.
  • Low-voltage operation — 1.14 V to 1.26 V supply range supports compatibility with low-voltage system rails.
  • Commercial-grade suitability — Rated for 0 °C to 85 °C operation for general-purpose commercial applications.
  • RoHS compliant — Supports lead-free assembly processes and environmental requirements.

Why Choose LFEC6E-4QN208C?

The LFEC6E-4QN208C combines a mid-range logic element count, substantial on-chip RAM and a high I/O count in a compact surface-mount 208-BFQFP package, making it a practical choice for commercial embedded designs that require flexible logic, interface density and moderate memory. Its defined voltage and temperature ranges and RoHS compliance align with standard commercial production needs.

Request a quote to check availability and pricing or submit a quote request to begin procurement and integration planning for the LFEC6E-4QN208C.

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