LFEC6E-4QN208I

The LFEC6E-4QN208I is a Lattice Semiconductor EC-family FPGA offering 6,100 logic elements, approximately 94 kbits of on-chip RAM (94,208 total bits) and 147 general-purpose I/Os in a 208-pin BFQFP package. Designed for industrial-grade embedded applications, this surface-mount device delivers a balanced mix of logic density, on-chip memory and flexible I/O for control, interfacing and system-integration tasks.

Key Features

• Core Logic  Approximately 6,100 logic elements provide programmable logic capacity for mid-range FPGA designs.
• On‑chip Memory  Total of 94,208 bits of embedded RAM to support control state, buffering and small data structures on-chip.
• I/O Capacity & Flexibility  147 I/O pins in the 208-BFQFP package enable broad peripheral and bus connectivity; family supports a wide range of I/O standards.
• Power  Core supply specified from 1.14 V to 1.26 V, consistent with low-voltage FPGA core operation.
• Clocking & System Support  Family-level support for analog PLLs and system clock management for clock multiply/divide and phase shifting functions.
• Memory Interface Support  Family supports dedicated DDR memory interfacing up to DDR400 (family-level feature).
• Package & Mounting  208-BFQFP (supplier package listed as 208-PQFP, 28 × 28 mm) for surface-mount board designs.
• Industrial Grade & Temperature Range  Specified operating temperature from −40 °C to 100 °C suitable for industrial environments.
• Compliance  RoHS compliant.

Typical Applications

• Industrial Control  Programmable logic and robust operating temperature range make the device suitable for motor control, discrete I/O aggregation and PLC-style functions in industrial systems.
• Protocol Bridging & I/O Aggregation  High I/O count supports protocol conversion, bus bridging and multi-peripheral interfacing in communication gateways and embedded controllers.
• Memory Interface Controllers  On-chip memory combined with family DDR support can be used for implementing memory controllers and buffering logic in embedded subsystems.
• Embedded System Integration  Mid-range logic density and flexible I/O enable customization of device-level logic, glue functions and board-level integration tasks.

Unique Advantages

• Balanced Logic and Memory:  About 6,100 logic elements paired with 94,208 bits of on-chip RAM deliver the capacity needed for moderate-complexity designs without external memory for many control and interface tasks.
• High I/O Count:  147 I/Os in a 208-pin package simplify connections to sensors, actuators and peripheral buses, reducing the need for external I/O expanders.
• Industrial Ready:  Specified −40 °C to 100 °C operating range and industrial grade classification support deployment in harsher environments.
• Low-Voltage Core:  Core supply between 1.14 V and 1.26 V aligns with low-power FPGA design practices and modern system power rails.
• Standard Surface-Mount Package:  208-BFQFP (28 × 28 mm) surface-mount package eases placement into standard PCB assembly flows.
• RoHS Compliant:  Meets RoHS requirements for environmental compliance in commercial and industrial products.

Why Choose LFEC6E-4QN208I?

The LFEC6E-4QN208I positions itself as a practical, industrial-grade FPGA option for embedded designs that require mid-range logic capacity, significant I/O density and on-chip RAM for control and interfacing functions. Its combination of approximately 6,100 logic elements, 94,208 bits of embedded memory and 147 I/Os in a 208-pin surface-mount package makes it well-suited for industrial control, protocol bridging and system integration tasks where reliable operation across −40 °C to 100 °C is required.

Supported by the Lattice ECP/EC family feature set—flexible I/O standards, PLL clocking and dedicated memory-interface capabilities—this device offers a practical balance of integration, performance and system-level support for mid-range FPGA applications.

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