LFEC6E-5F484C
| Part Description |
EC Field Programmable Gate Array (FPGA) IC 224 94208 6100 484-BBGA |
|---|---|
| Quantity | 1,672 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 224 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 768 | Number of Logic Elements/Cells | 6100 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 94208 |
Overview of LFEC6E-5F484C – EC Field Programmable Gate Array (FPGA) IC 224 94208 6100 484-BBGA
The LFEC6E-5F484C is a commercial-grade field programmable gate array (FPGA) from Lattice Semiconductor Corporation. It provides a configurable logic fabric with 6,100 logic elements, approximately 94,208 bits of embedded RAM, and up to 224 I/O pins in a compact 484-ball BGA package.
Designed for commercial embedded applications, this device targets designs that require moderate logic density, substantial on-chip memory, and a high I/O count while operating within a 1.14 V to 1.26 V core supply range and an ambient temperature window of 0 °C to 85 °C.
Key Features
- Core Logic Provides 6,100 logic elements for implementing custom digital functions and control logic.
- Embedded Memory Approximately 94,208 bits of on-chip RAM to support buffering, state storage, and small data structures without external memory.
- I/O Capability Up to 224 I/O pins to connect sensors, peripherals, or interface buses directly to the FPGA fabric.
- Power Operates from a core voltage supply between 1.14 V and 1.26 V to match low-voltage system domains.
- Package 484-ball FBGA (23 mm × 23 mm) surface-mount package for dense board-level integration.
- Operating Range Commercial temperature rating with an operating range of 0 °C to 85 °C.
- Compliance RoHS compliant, meeting common environmental substance restrictions for commercial electronic products.
Typical Applications
- Commercial Embedded Systems Implement custom control and processing logic where moderate logic density and on-chip memory are required.
- I/O Expansion and Interface Bridging Use the high I/O count to connect multiple peripherals, sensors, or bus interfaces to a single programmable device.
- Prototyping and Development Provide a reprogrammable hardware platform for development of new digital designs within commercial temperature environments.
Unique Advantages
- Configurable Logic Capacity: 6,100 logic elements give designers the ability to implement a variety of custom digital functions without external ASICs.
- Significant On-Chip Memory: Approximately 94,208 bits of embedded RAM reduce dependence on external memory for control buffering and small data storage.
- High I/O Count: 224 I/O pins support connection to multiple peripherals and interfaces directly from the FPGA fabric.
- Compact BGA Package: 484-ball FBGA (23×23 mm) enables dense board integration while maintaining a large pin count.
- Low-Voltage Operation: Core supply range of 1.14 V to 1.26 V aligns with lower-voltage system domains.
- Commercial Temperature Rating: Specified for 0 °C to 85 °C operation to match typical commercial application environments.
Why Choose LFEC6E-5F484C?
The LFEC6E-5F484C positions itself as a versatile commercial FPGA option that balances mid-range logic capacity, embedded memory, and a high I/O count in a compact 484-BBGA package. Its specifications suit designers needing a reprogrammable device capable of handling multiple interfaces and on-chip data buffering within standard commercial temperature and power envelopes.
This device is appropriate for engineering teams and procurement sourcing components for commercial embedded designs, interface bridging, or development platforms that require a programmable logic solution with clear, verifiable specifications for logic elements, memory, I/O, package, power, and operating temperature.
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