LFEC6E-5FN256C

The LFEC6E-5FN256C is a commercial-grade EC family FPGA offering a balance of programmable logic, embedded memory, and flexible I/O in a compact 256-ball BGA (17 × 17 mm) package. Built on the LatticeECP/EC family architecture, it provides LUT-based logic, distributed and embedded memory, multiple PLLs and dedicated DDR memory interface support for mainstream, cost-sensitive FPGA applications.

This device is targeted at designers who need approximately 6,100 logic elements, around 94,208 bits of on-chip RAM and up to 195 I/O signals, while operating from a low-voltage core supply and standard commercial temperature range.

Key Features

• Core Logic — Approximately 6,100 logic elements (logic element cells) for implementing combinational and sequential logic.
• On-chip Memory — Total RAM bits: 94,208, providing distributed and embedded memory resources for buffering, state storage and small data arrays.
• I/O Capacity & Flexibility — 195 I/O pins with a programmable sysI/O buffer architecture supporting a broad range of interfaces listed for the LatticeECP/EC family (including LVCMOS, LVTTL, SSTL, HSTL, PCI, LVDS, Bus-LVDS, LVPECL and RSDS).
• Clocking & Memory Interface — Family-level support includes multiple analog PLLs and dedicated DDR memory interface logic suitable for interfaces up to DDR400 (as described for the family).
• Power — Core supply operating range: 1.14 V to 1.26 V, enabling low-voltage system integration.
• Package & Mounting — 256-ball fpBGA (17 × 17 mm) supplier device package; surface mount mounting type.
• Temperature & Grade — Commercial grade with operating temperature range 0 °C to 85 °C.
• Compliance — RoHS compliant.
• Design Flow & IP — Part of the LatticeECP/EC family supported by the ispLEVER design tool suite and available ispLeverCORE IP modules for accelerated development (family-level tooling described in the datasheet).

Typical Applications

• Mainstream embedded systems — Use the LFEC6E-5FN256C for general-purpose embedded control and logic consolidation where a mix of logic, memory and I/O density is required.
• Memory-interface designs — Family-level dedicated DDR memory interface support makes this device suitable for designs requiring direct DDR interfacing up to the specified family limits.
• High-density I/O subsystems — With 195 I/Os and a programmable sysI/O buffer, this FPGA fits designs that need diverse signaling standards and multiple peripheral interfaces.
• Prototyping and IP-based integration — Supported by the ispLEVER tool suite and ispLeverCORE modules to speed implementation of IP-based subsystems and prototype development.

Unique Advantages

• Balanced integration: Combines approximately 6,100 logic elements with embedded and distributed memory to implement compact system logic and buffering on a single device.
• Flexible I/O support: Programmable sysI/O buffering supports a wide range of signaling standards (LVCMOS, LVTTL, SSTL, HSTL, PCI, LVDS, Bus-LVDS, LVPECL, RSDS), reducing external interface components.
• Compact packaging: 256-ball fpBGA (17 × 17 mm) provides high pin-count in a small footprint suitable for space-constrained boards.
• Low-voltage operation: Core supply range of 1.14 V to 1.26 V supports modern low-voltage system architectures.
• Commercial temperature and compliance: Commercial grade operation from 0 °C to 85 °C and RoHS compliance for standard production environments.
• Toolchain and IP ecosystem: Integration with the ispLEVER design tools and available ispLeverCORE IP modules accelerates design implementation and validation.

Why Choose LFEC6E-5FN256C?

The LFEC6E-5FN256C positions itself as a cost-conscious, feature-balanced FPGA for mainstream designs that require moderate logic density, a substantial number of I/Os, and on-chip memory within a compact BGA footprint. Its family-level architecture delivers essential FPGA building blocks—LUT-based logic, embedded and distributed memory, PLLs and DDR interface support—backed by an established design flow.

This device is well suited to engineering teams implementing embedded systems, interface-intensive modules, or memory-connected subsystems who value a combination of integration, design-tool support and a small-package form factor for production in standard commercial environments.

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