LFECP6E-4TN144C
| Part Description |
ECP Field Programmable Gate Array (FPGA) IC 97 94208 6100 144-LQFP |
|---|---|
| Quantity | 1,053 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 144-TQFP (20x20) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LQFP | Number of I/O | 97 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 768 | Number of Logic Elements/Cells | 6100 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 94208 |
Overview of LFECP6E-4TN144C – ECP Field Programmable Gate Array 144-LQFP
The LFECP6E-4TN144C is an ECP Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation, delivered in a 144-pin LQFP surface-mount package. It provides 6,100 logic elements, approximately 94,208 bits of on-chip RAM, and 97 user I/O pins for customizable digital logic implementations.
With a nominal supply range of 1.14 V to 1.26 V and a commercial operating temperature range of 0 °C to 85 °C, this device targets designs that require moderate logic density, integrated memory, and a compact LQFP footprint for surface-mount assembly.
Key Features
- Logic Capacity 6,100 logic elements for implementing customizable digital logic and finite-state machines.
- Embedded Memory Approximately 0.094 Mbits (94,208 bits) of on-chip RAM to support buffering, small data stores, and local state.
- I/O Density 97 general-purpose I/O pins to interface with peripherals, sensors, and external logic.
- Power Supply Operates from 1.14 V to 1.26 V, suitable for low-voltage digital designs.
- Package and Mounting 144-LQFP (144-TQFP 20×20 supplier device package) in a surface-mount form factor for compact board layouts.
- Temperature Grade Commercial grade operation from 0 °C to 85 °C for mainstream consumer and industrial applications.
- Standards Compliance RoHS compliant for lead-free assembly and regulatory alignment.
Typical Applications
- Custom Logic Prototyping Implement and iterate on custom digital functions using the 6,100 logic elements and available on-chip RAM.
- I/O Expansion and Bridging Use the 97 I/O pins to bridge peripherals, expand interfaces, or consolidate multiple discrete components into programmable logic.
- Embedded Control Support control and timing tasks where moderate local memory and flexible I/O assignment are required within a compact 144-LQFP package.
Unique Advantages
- Balanced Logic and Memory: 6,100 logic elements paired with approximately 0.094 Mbits of embedded RAM offers a balanced platform for designs needing both logic capacity and local data storage.
- High I/O Count: 97 user I/Os enable flexible interfacing with sensors, actuators, and external buses without requiring additional interface ICs.
- Low-Voltage Operation: 1.14 V to 1.26 V supply range supports integration into modern low-voltage system designs.
- Compact Surface-Mount Package: 144-LQFP surface-mount package (supplier device package 144-TQFP 20×20) simplifies board layout while maintaining accessible pin count.
- Commercial Temperature Rating: Rated for 0 °C to 85 °C to meet mainstream application environmental requirements.
- RoHS Compliant: Conforms to RoHS for lead-free assembly and compliance-driven designs.
Why Choose LFECP6E-4TN144C?
The LFECP6E-4TN144C from Lattice Semiconductor Corporation offers a practical combination of logic density, embedded RAM, and a high I/O count in a compact 144-LQFP surface-mount package. Its low-voltage operation and commercial temperature rating make it suitable for a wide range of mainstream programmable logic applications where board space and power are considerations.
This device is well suited for designers and engineers building custom digital functions, I/O-intensive interfaces, or embedded control systems that benefit from on-chip memory and a flexible I/O fabric while maintaining RoHS-compliant assembly practices.
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