LFECP6E-5FN256C

IC FPGA 195 I/O 256FBGA
Part Description

ECP Field Programmable Gate Array (FPGA) IC 195 94208 6100 256-BGA

Quantity 1,258 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BGANumber of I/O195Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs768Number of Logic Elements/Cells6100
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits94208

Overview of LFECP6E-5FN256C – ECP Field Programmable Gate Array, 256‑BGA, 195 I/Os

The LFECP6E-5FN256C is a commercial‑grade FPGA from Lattice Semiconductor’s LatticeECP family, delivered in a 256-ball fpBGA (17 × 17 mm) surface‑mount package. The device provides approximately 6,100 logic elements, about 94 Kbits of total on‑chip RAM, and 195 user I/Os, targeting mainstream, cost‑sensitive system designs that require flexible I/O and embedded memory resources.

Built around the LatticeECP architecture, the device emphasizes efficient LUT‑based logic, embedded and distributed memory, and system support features such as PLLs and dedicated DDR memory interface capability from the family data. It is intended for commercial applications operating from 0 °C to 85 °C with a low‑voltage core supply range of 1.14 V to 1.26 V.

Key Features

  • Core Logic  Approximately 6,100 logic elements (LUT‑based fabric) suitable for implementing control, glue logic, and moderate‑density digital functions.
  • On‑Chip Memory  Approximately 94 Kbits of total on‑chip RAM (embedded and distributed memory resources) for data buffering and small RAM structures.
  • I/O Count & Flexibility  195 user I/Os in a 256‑ball fpBGA package to support a broad set of external interfaces and board routing options.
  • Voltage & Power  Core supply specified between 1.14 V and 1.26 V to match low‑voltage system domains.
  • Temperature & Grade  Commercial grade device rated for 0 °C to 85 °C operation.
  • Package & Mounting  256‑FPBGA (17 × 17 mm) surface‑mount package for compact board designs and high I/O density.
  • Family System Features  As a member of the LatticeECP family, the device benefits from family features such as embedded and distributed memory resources, programmable I/O buffers supporting a wide range of standards, dedicated DDR memory interface logic, and analog PLLs for clock management (family data).
  • Regulatory  RoHS compliant.

Typical Applications

  • Communications & Networking  Implement interface logic, protocol bridging, and DDR memory interfaces where flexible I/O and embedded memory are required.
  • Industrial Control  Glue logic, sensor aggregation and control functions in commercial‑temperature automation equipment using the device’s compact package and I/O count.
  • Consumer & Embedded Systems  Interface controllers, peripheral aggregation and system glue for cost‑sensitive consumer electronics and embedded devices.
  • Storage & Memory Interfaces  Support for dedicated DDR memory interface logic in the family makes the device suitable for applications that require external memory controllers and buffering.

Unique Advantages

  • High I/O density in a compact footprint: 195 I/Os in a 17 × 17 mm 256‑ball fpBGA enable dense connectivity without large board area.
  • Right‑sized logic and memory: ~6,100 logic elements and ~94 Kbits of on‑chip RAM provide an efficient balance of resources for mainstream designs.
  • Low‑voltage core compatibility: 1.14 V to 1.26 V supply range aligns with modern low‑voltage system domains.
  • Commercial temperature rating: Rated 0 °C to 85 °C for reliable operation in commercial applications.
  • Broad family ecosystem: Part of the LatticeECP family, which includes design tool support and pre‑packaged IP options to accelerate development (family data).
  • RoHS compliant: Meets contemporary environmental requirements for lead‑free manufacturing.

Why Choose LFECP6E-5FN256C?

The LFECP6E-5FN256C delivers a compact, commercially rated FPGA option for designers needing a balance of logic resources, embedded memory, and high I/O count in a 256‑ball fpBGA package. Its low‑voltage core, family‑level support for DDR interfaces and PLLs, and RoHS compliance make it suitable for a wide range of mainstream, cost‑sensitive embedded designs.

Choose this device when your project requires a reliable, well‑scoped FPGA solution backed by the LatticeECP family ecosystem and design tool support, enabling efficient implementation of interface logic, memory controllers, and system glue with a reduced BOM impact.

Request a quote or submit a product inquiry to obtain pricing and availability for the LFECP6E-5FN256C.

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