LFECP6E-5QN208C

The LFECP6E-5QN208C is a commercial-grade, surface-mount FPGA from Lattice Semiconductor’s ECP family. It delivers approximately 6,100 logic elements and roughly 94 Kbits of on-chip RAM in a compact 208-pin PQFP (28 × 28 mm) package, making it suitable for a wide range of commercial embedded designs that require programmable logic, flexible I/O and on-chip memory.

This device targets mainstream applications requiring configurable logic capacity, a broad I/O set and low-voltage core operation (1.14 V to 1.26 V), while operating across a commercial temperature range of 0 °C to 85 °C.

Key Features

• Logic Capacity  Approximately 6,100 logic elements for implementing mid-density programmable logic and glue-logic functions.
• On‑Chip Memory  Total on-chip RAM: 94,208 bits (approximately 94 Kbits) for distributed and embedded memory usage in data buffering and state storage.
• I/O Count and Flexibility  147 user I/Os delivered in the 208-pin package; family-level programmable sysI/O buffers support a wide range of interface standards.
• Programmable I/O Standards  Family documentation lists support for LVCMOS (3.3/2.5/1.8/1.5/1.2), LVTTL, SSTL (3/2, SSTL18), HSTL (18/15), PCI, LVDS, Bus‑LVDS, LVPECL and RSDS signaling (as provided by the ECP family).
• Clocking  Provides up to two analog PLLs for clock multiply/divide and phase shifting (device-level PLL count for this family entry).
• Memory Interface Support  Family-level support for dedicated DDR memory interfaces (up to DDR400) to simplify external memory integration where required.
• System-Level Features  Includes family-provided system features such as IEEE 1149.1 boundary-scan, SPI boot flash interface and ispTRACY internal logic analyzer capability.
• Package and Mounting  208-BFQFP / supplier package listed as 208-PQFP (28 × 28 mm) in a surface-mount form factor for compact board integration.
• Power and Environmental  Low-voltage core operation with specified supply range of 1.14 V to 1.26 V; RoHS compliant; commercial operating temperature 0 °C to 85 °C.

Typical Applications

• Communications Equipment  Protocol bridging, interface adaptation and custom packet processing using the device’s programmable logic and flexible I/O.
• Consumer and Commercial Electronics  Control logic, peripheral interfacing and user‑feature integration where mid-range logic density and on‑chip RAM are required.
• Embedded Control and Instrumentation  Custom state machines, data aggregation and pre-processing functions that benefit from integrated logic and memory.
• Memory Interface and Buffering  Systems leveraging the family’s DDR interface support and on‑chip RAM for buffering and external memory coordination.

Unique Advantages

• Right-sized Logic Capacity:  Approximately 6,100 logic elements balance capability and cost for mid-density designs.
• Generous I/O Count:  147 available I/Os in a 208-pin PQFP package simplifies integration of multiple peripherals and interfaces without larger packages.
• Flexible I/O Standards:  Programmable I/O buffers support a broad set of signaling standards for easy interface adaptation across commercial systems.
• Low-Voltage Core:  Specified supply range of 1.14 V to 1.26 V supports modern low-voltage system architectures.
• Compact Surface-Mount Package:  208-BFQFP (208-PQFP, 28 × 28 mm) enables dense PCB layouts while retaining high I/O count.
• Compliance and Integration:  RoHS compliance and family-level system features (boundary-scan, SPI boot, internal logic analysis) simplify development and manufacturing.

Why Choose LFECP6E-5QN208C?

The LFECP6E-5QN208C provides a balanced combination of mid-range programmable logic, on-chip memory and flexible I/O in a compact commercial-grade package. Its specification set — including approximately 6,100 logic elements, ~94 Kbits of RAM, 147 I/Os and a low-voltage core — makes it well suited for commercial embedded systems, communications interfaces and control applications that require configurable logic without oversized hardware.

Backed by the ECP family’s system-level capabilities (clocking PLLs, boundary-scan, SPI boot and family I/O flexibility), this device offers scalable integration for designs that may evolve within the same FPGA family and benefit from existing design tool support and IP resources provided at the family level.

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