LFMNX-50-5CBG256I
| Part Description |
Mach™-NX Field Programmable Gate Array (FPGA) IC 188 442368 8400 256-TFBGA, CSPBGA |
|---|---|
| Quantity | 55 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-CSFBGA (14x14) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-TFBGA, CSPBGA | Number of I/O | 188 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1050 | Number of Logic Elements/Cells | 8400 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 442368 |
Overview of LFMNX-50-5CBG256I – Mach™-NX FPGA, 8,400 logic elements, 188 I/Os
The LFMNX-50-5CBG256I is a Mach™-NX field programmable gate array (FPGA) in a 256-TFBGA (14×14) CSPBGA package designed for industrial applications. It integrates 8,400 logic elements, approximately 0.44 Mbits of embedded RAM, and 188 I/O pins to support mid-density programmable logic and I/O-intensive designs.
Built on the Mach‑NX family architecture, this device provides flexible on‑chip clocking, programmable I/O, and security-oriented features described in the Mach‑NX datasheet, enabling developers to implement I/O bridging, embedded control, and secure processing functions within a compact, surface‑mount BGA footprint.
Key Features
- Logic Capacity — 8,400 logic elements to implement mid-density programmable logic, state machines, and glue‑logic functions.
- Embedded Memory — 442,368 bits of on‑chip RAM (approximately 0.44 Mbits) for local buffering, FIFOs, and small data structures.
- I/O Density — 188 programmable I/Os with support for the Mach‑NX family’s pre‑engineered source synchronous and flexible I/O buffering options as documented in the family datasheet.
- Power Supply — Low‑voltage core operation with a specified supply range of 950 mV to 1.05 V.
- Industrial Temperature Grade — Specified operating range from −40 °C to 100 °C for industrial environments.
- Secure and SoC Capabilities — Family features include a cryptographic secure enclave and hardened SoC function blocks described in the Mach‑NX documentation for designs that require protected processing and embedded IP functions.
- Reconfiguration & Non‑Volatility — Mach‑NX family features such as non‑volatile reconfiguration and TransFR reconfiguration are available as part of the device family architecture.
- Clocking and Memory Subsystems — Flexible on‑chip clocking with PLLs and sysMEM embedded block RAM capabilities described in the Mach‑NX datasheet for synchronized and memory‑centric designs.
- Package & Mounting — Surface‑mount 256‑TFBGA (256‑CSFBGA, 14×14) package suitable for compact PCB implementations; RoHS compliant.
Typical Applications
- Industrial Control — Reliable operation across −40 °C to 100 °C and a compact BGA package make the device suitable for motor control, process automation interfaces, and embedded sequencing logic.
- I/O Aggregation and Protocol Bridging — With 188 I/Os and family support for source‑synchronous I/O, the device excels at bridging between sensors, legacy interfaces, and modern peripherals.
- Secure Edge Processing — Cryptographic secure enclave and hardened SoC features from the Mach‑NX family enable secure data handling and localized encryption/decryption tasks.
- Embedded Memory Tasks — Approximately 0.44 Mbits of on‑chip RAM and sysMEM features support buffering, FIFOs, and small embedded data structures for real‑time processing.
Unique Advantages
- Balanced Logic and Memory — 8,400 logic elements paired with ~0.44 Mbits of embedded RAM provides the right mix for mid‑range programmable designs without excessive board‑level memory.
- High I/O Count in a Small Package — 188 I/Os in a 256‑TFBGA (14×14) footprint reduces PCB area while preserving signal‑rich connectivity.
- Industrial Temperature Range — Rated for −40 °C to 100 °C to meet the needs of industrial deployments and harsh environments.
- Low‑Voltage Core — Core supply between 950 mV and 1.05 V supports modern low‑power system architectures and power budget management.
- Family-Level Security and SoC Features — Mach‑NX family capabilities such as a secure enclave and hardened SoC blocks enable integration of protected processing and embedded IP.
- Reconfigurability and On‑Chip Resources — Non‑volatile reconfiguration, flexible clocking (PLLs), and programmable I/O cells provide design flexibility across multiple use cases.
Why Choose LFMNX-50-5CBG256I?
The LFMNX-50-5CBG256I combines mid‑density logic, substantial I/O, and embedded memory in a compact industrial package, making it a practical choice for engineers building I/O‑heavy, secure, or embedded control systems. Its low‑voltage core and Mach‑NX family features deliver design flexibility for implementations that require reconfigurability, on‑chip memory, and secure processing blocks.
This device is well suited to customers who need a scalable, robust FPGA platform for industrial applications where compact PCB footprint, extensive I/O, and family‑level security and clocking features are important. The Mach‑NX architecture and embedded resources support concise BOMs and focused system integration.
Request a quote or submit a purchase inquiry to get pricing and availability for LFMNX-50-5CBG256I. Our team can provide lead‑time and order details to support your design schedule.

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