LFMNX-50-5CBG256C

IC FPGA MACH-NX 384BIT 256BGA
Part Description

Mach™-NX Field Programmable Gate Array (FPGA) IC 188 442368 8400 256-TFBGA, CSPBGA

Quantity 659 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-CSFBGA (14x14)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-TFBGA, CSPBGANumber of I/O188Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1050Number of Logic Elements/Cells8400
Number of GatesN/AECCNN/AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits442368

Overview of LFMNX-50-5CBG256C – Mach™-NX FPGA, 8,400 logic elements, 188 I/Os, 256‑TFBGA

The LFMNX-50-5CBG256C is a Mach™-NX family Field Programmable Gate Array (FPGA) in a 256‑TFBGA (CSPBGA) package. It integrates a reconfigurable logic fabric, on-chip embedded memory, and flexible I/O to address commercial embedded designs that require compact, reconfigurable system logic and secure on-chip features.

With 8,400 logic elements, 188 I/O pins and approximately 0.44 Mbits of embedded RAM, this Mach‑NX device is positioned for applications requiring dense I/O, low-voltage operation, and support for secure and system-level functions provided by the Mach‑NX architecture.

Key Features

  • Logic Fabric 1,050 logic blocks and 8,400 logic elements for implementing custom digital logic and control functions.
  • Embedded Memory Approximately 0.44 Mbits of on-chip RAM (442,368 total RAM bits) for data buffering, FIFOs, and small on-chip storage.
  • I/O Density 188 I/O pins with support for the Mach‑NX family’s pre‑engineered source synchronous I/O and flexible I/O buffering.
  • Low-Voltage Core Core supply voltage from 0.95 V to 1.05 V for low-voltage system integration.
  • Secure and System Functions Mach‑NX family features include a cryptographic secure enclave and SoC function block capabilities for secured system integration and embedded IP.
  • Reconfiguration and Non‑Volatile Operation Non-volatile, reconfigurable architecture with TransFR reconfiguration support as part of the Mach‑NX feature set.
  • Clocking and Memory Blocks Flexible on-chip clocking including PLLs, and sysMEM embedded block RAM with multiple modes (single/dual/pseudo-dual port and FIFO configurations).
  • Package and Mounting 256‑TFBGA (CSPBGA) package; supplier device package listed as 256‑CSFBGA (14×14). Surface-mount mounting type.
  • Commercial Grade and Compliance Commercial operating temperature range 0 °C to 85 °C and RoHS compliant.

Typical Applications

  • Communications and Interface Bridging Use the device’s source synchronous I/O and flexible buffering to implement protocol bridging, interface adaptation, and I/O expansion.
  • Embedded Control and Logic Implement custom control logic, state machines, and housekeeping functions using the device’s logic fabric and on‑chip RAM.
  • Security and Secure Elements Leverage the Mach‑NX cryptographic secure enclave and SoC function block capabilities for secure key handling and protected firmware functions.
  • Prototyping and System Integration Compact package and non‑volatile reconfiguration make this device suitable for development platforms and space‑constrained system-level integration.

Unique Advantages

  • Highly integrated logic and memory: 8,400 logic elements combined with approximately 0.44 Mbits of embedded RAM reduce external component count for many common functions.
  • Dense I/O capability: 188 I/Os allow extensive peripheral and interface connections in a single device footprint.
  • Low-voltage core operation: 0.95–1.05 V supply supports low-power system designs and modern power-rail architectures.
  • Secure system building blocks: On-chip secure enclave and SoC block features enable hardware-assisted security without adding discrete security ICs.
  • Compact, manufacturable package: 256‑TFBGA (14×14 CSFBGA) surface-mount package provides a small form factor for space-constrained boards.
  • Commercially qualified: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial deployments.

Why Choose LFMNX-50-5CBG256C?

The LFMNX-50-5CBG256C offers a balanced combination of reconfigurable logic, embedded memory, and extensive I/O in a compact 256‑TFBGA package. Its Mach‑NX family features—secure enclave, flexible I/O, and on‑chip clocking and memory modes—make it suitable for commercial embedded designs that require secure functionality, interface flexibility, and in-field reconfiguration.

Designed for engineers who need a compact, low-voltage FPGA with integrated system capabilities, this device supports scalable designs and reduces BOM complexity while providing the Mach‑NX architectural features for secure and flexible system implementation.

Request a quote or submit an inquiry to receive pricing, availability, and lead-time information for LFMNX-50-5CBG256C.

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