LFMNX-50-5FBG484C

IC FPGA MACH-NX 384BIT 484BGA
Part Description

Mach™-NX Field Programmable Gate Array (FPGA) IC 379 442368 8400 484-LFBGA

Quantity 182 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package484-CABGA (19x19)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-LFBGANumber of I/O379Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs1050Number of Logic Elements/Cells8400
Number of GatesN/AECCNN/AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits442368

Overview of LFMNX-50-5FBG484C – Mach™-NX Field Programmable Gate Array (FPGA) IC 379 442368 8400 484-LFBGA

The LFMNX-50-5FBG484C is a Mach™-NX family FPGA from Lattice Semiconductor, delivered in a 484-LFBGA surface-mount package (484-CABGA, 19×19). It provides a configurable logic fabric with 8,400 logic elements and approximately 0.44 Mbits of embedded RAM, plus a high I/O count of 379 pins for dense, system-level connectivity.

Designed for commercial-temperature systems, this device combines flexible on-chip clocking, programmable I/O, and non-volatile reconfiguration features from the Mach‑NX family to support applications that require embedded memory, extensive I/O, and integrated SoC-style functions.

Key Features

  • Logic Capacity — 8,400 logic elements to implement medium-scale digital functions and custom logic.
  • On-chip Memory — Approximately 0.44 Mbits of sysMEM embedded block RAM with single, dual, pseudo-dual port and FIFO modes for flexible data buffering and storage.
  • I/O Density & Flexibility — 379 I/O pins with pre‑engineered source-synchronous I/O and high-performance, flexible I/O buffer options for varied signaling needs.
  • Security & SoC Integration — Mach‑NX family features include a Cryptographic Secure Enclave and Hardened SoC function blocks for integrated system functions and secure key handling.
  • Reconfiguration & Non‑Volatile Options — Non-volatile, reconfigurable architecture with TransFR reconfiguration and on‑chip User Flash Memory (UFM) for configuration storage and field updates.
  • Clocking & Timing — Flexible on-chip clocking with sysCLOCK PLLs to support a range of internal timing and phase-locked requirements.
  • Power & Operating Range — Core supply voltage range of 0.95 V to 1.05 V and commercial operating temperature range of 0 °C to 85 °C; RoHS compliant.
  • Package & Mounting — 484-LFBGA (484-CABGA, 19×19) package, surface-mount for compact board-level integration.
  • System Features — Includes programmable I/O cells, on‑chip oscillator, standby mode and power-saving options, and hot-socketing support described in the Mach‑NX family documentation.

Typical Applications

  • Communications Equipment — Use the device’s high I/O count and source-synchronous I/O for protocol bridging, interface adaptation, and data path customization.
  • Embedded SoC Prototyping — Hardened SoC blocks, secure enclave features, and flexible reconfiguration make it suitable for prototyping integrated system functions and secure modules.
  • Instrumentation & Test — Embedded RAM, flexible clocking, and plentiful I/O support data acquisition, buffering, and custom timing logic for test platforms.
  • Consumer & Industrial Electronics (Commercial Grade) — Apply programmable logic and on-chip memory for display controllers, sensor aggregation, and control logic within commercial-temperature limits.

Unique Advantages

  • Balanced Logic and Memory: 8,400 logic elements combined with approximately 0.44 Mbits of embedded RAM provide a balanced fabric for control, buffering, and stateful logic without external RAM for many use cases.
  • High I/O Integration: 379 programmable I/O pins reduce the need for external interface chips and simplify system routing for multi-interface designs.
  • Secure Platform Primitives: Built-in cryptographic secure enclave and hardened SoC blocks enable integration of security and system functions while keeping sensitive operations on-chip.
  • Flexible Reconfiguration: Non-volatile reconfiguration, TransFR support, and User Flash Memory let you update functionality in the field and store multiple configurations securely.
  • Compact, Board‑Friendly Package: 484-LFBGA surface-mount package (19×19) provides a compact footprint for space-constrained PCBs while delivering high I/O density.
  • Commercial Temperature and RoHS Compliance: Specified for 0 °C to 85 °C operation and RoHS compliant to meet standard commercial product requirements.

Why Choose LFMNX-50-5FBG484C?

The LFMNX-50-5FBG484C positions itself as a mid-range Mach‑NX FPGA option that combines a practical balance of logic resources, embedded memory, and a large complement of I/O in a compact 484-LFBGA package. Its Mach‑NX family capabilities—secure enclave, flexible clocking and I/O, non-volatile reconfiguration, and hardened SoC elements—make it well suited to designs that require on-chip security, configurable interfaces, and in-field updateability within commercial-temperature systems.

This device is a fit for engineering teams building communications modules, embedded SoC prototypes, test and measurement equipment, and other commercial applications that need integrated logic, memory, and I/O without adding external configuration or memory devices.

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