LFMNX-50-5FBG484C
| Part Description |
Mach™-NX Field Programmable Gate Array (FPGA) IC 379 442368 8400 484-LFBGA |
|---|---|
| Quantity | 182 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-CABGA (19x19) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-LFBGA | Number of I/O | 379 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 1050 | Number of Logic Elements/Cells | 8400 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 442368 |
Overview of LFMNX-50-5FBG484C – Mach™-NX Field Programmable Gate Array (FPGA) IC 379 442368 8400 484-LFBGA
The LFMNX-50-5FBG484C is a Mach™-NX family FPGA from Lattice Semiconductor, delivered in a 484-LFBGA surface-mount package (484-CABGA, 19×19). It provides a configurable logic fabric with 8,400 logic elements and approximately 0.44 Mbits of embedded RAM, plus a high I/O count of 379 pins for dense, system-level connectivity.
Designed for commercial-temperature systems, this device combines flexible on-chip clocking, programmable I/O, and non-volatile reconfiguration features from the Mach‑NX family to support applications that require embedded memory, extensive I/O, and integrated SoC-style functions.
Key Features
- Logic Capacity — 8,400 logic elements to implement medium-scale digital functions and custom logic.
- On-chip Memory — Approximately 0.44 Mbits of sysMEM embedded block RAM with single, dual, pseudo-dual port and FIFO modes for flexible data buffering and storage.
- I/O Density & Flexibility — 379 I/O pins with pre‑engineered source-synchronous I/O and high-performance, flexible I/O buffer options for varied signaling needs.
- Security & SoC Integration — Mach‑NX family features include a Cryptographic Secure Enclave and Hardened SoC function blocks for integrated system functions and secure key handling.
- Reconfiguration & Non‑Volatile Options — Non-volatile, reconfigurable architecture with TransFR reconfiguration and on‑chip User Flash Memory (UFM) for configuration storage and field updates.
- Clocking & Timing — Flexible on-chip clocking with sysCLOCK PLLs to support a range of internal timing and phase-locked requirements.
- Power & Operating Range — Core supply voltage range of 0.95 V to 1.05 V and commercial operating temperature range of 0 °C to 85 °C; RoHS compliant.
- Package & Mounting — 484-LFBGA (484-CABGA, 19×19) package, surface-mount for compact board-level integration.
- System Features — Includes programmable I/O cells, on‑chip oscillator, standby mode and power-saving options, and hot-socketing support described in the Mach‑NX family documentation.
Typical Applications
- Communications Equipment — Use the device’s high I/O count and source-synchronous I/O for protocol bridging, interface adaptation, and data path customization.
- Embedded SoC Prototyping — Hardened SoC blocks, secure enclave features, and flexible reconfiguration make it suitable for prototyping integrated system functions and secure modules.
- Instrumentation & Test — Embedded RAM, flexible clocking, and plentiful I/O support data acquisition, buffering, and custom timing logic for test platforms.
- Consumer & Industrial Electronics (Commercial Grade) — Apply programmable logic and on-chip memory for display controllers, sensor aggregation, and control logic within commercial-temperature limits.
Unique Advantages
- Balanced Logic and Memory: 8,400 logic elements combined with approximately 0.44 Mbits of embedded RAM provide a balanced fabric for control, buffering, and stateful logic without external RAM for many use cases.
- High I/O Integration: 379 programmable I/O pins reduce the need for external interface chips and simplify system routing for multi-interface designs.
- Secure Platform Primitives: Built-in cryptographic secure enclave and hardened SoC blocks enable integration of security and system functions while keeping sensitive operations on-chip.
- Flexible Reconfiguration: Non-volatile reconfiguration, TransFR support, and User Flash Memory let you update functionality in the field and store multiple configurations securely.
- Compact, Board‑Friendly Package: 484-LFBGA surface-mount package (19×19) provides a compact footprint for space-constrained PCBs while delivering high I/O density.
- Commercial Temperature and RoHS Compliance: Specified for 0 °C to 85 °C operation and RoHS compliant to meet standard commercial product requirements.
Why Choose LFMNX-50-5FBG484C?
The LFMNX-50-5FBG484C positions itself as a mid-range Mach‑NX FPGA option that combines a practical balance of logic resources, embedded memory, and a large complement of I/O in a compact 484-LFBGA package. Its Mach‑NX family capabilities—secure enclave, flexible clocking and I/O, non-volatile reconfiguration, and hardened SoC elements—make it well suited to designs that require on-chip security, configurable interfaces, and in-field updateability within commercial-temperature systems.
This device is a fit for engineering teams building communications modules, embedded SoC prototypes, test and measurement equipment, and other commercial applications that need integrated logic, memory, and I/O without adding external configuration or memory devices.
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