LIFCL-40-8SG72C
| Part Description |
CrossLink-NX™ Field Programmable Gate Array (FPGA) IC 40 1548288 39000 72-VFQFN Exposed Pad |
|---|---|
| Quantity | 533 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 72-QFN (10x10) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 72-VFQFN Exposed Pad | Number of I/O | 40 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 9750 | Number of Logic Elements/Cells | 39000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 1548288 |
Overview of LIFCL-40-8SG72C – CrossLink-NX™ Field Programmable Gate Array (FPGA), 40 I/O
The LIFCL-40-8SG72C is a CrossLink-NX™ Field Programmable Gate Array (FPGA) IC from Lattice Semiconductor Corporation. It delivers approximately 39,000 logic elements and about 1.55 Mbits of embedded RAM in a compact 72-QFN (10×10) exposed-pad package.
This device is supplied as a surface-mount commercial-grade FPGA designed for applications that require flexible, on-chip programmable logic, dedicated I/O, and on-chip memory within a 0 °C to 85 °C operating range.
Key Features
- Logic Capacity Approximately 39,000 logic elements to implement custom logic, state machines, and glue logic directly on-chip.
- Embedded Memory Approximately 1.55 Mbits of on-chip RAM for buffering, LUT-based storage, and memory-intensive functions.
- I/O Count 40 dedicated I/O pins provide flexible interfacing options for peripheral connections and board-level signal routing.
- Low-Voltage Core Core voltage supply range of 0.95 V to 1.05 V to support low-voltage system designs.
- Package & Mounting 72-VFQFN exposed pad, supplier package 72-QFN (10×10), optimized for surface-mount assembly and thermal conduction through the exposed pad.
- Commercial Temperature Grade Rated for operation from 0 °C to 85 °C for commercial applications.
- Regulatory Compliance RoHS-compliant material construction.
Typical Applications
- Programmable Logic Integration Implement custom combinational and sequential logic functions where on-chip logic density and embedded RAM are required.
- I/O Control and Interface Serve as a flexible interface controller using the 40 available I/O pins for signal conditioning, protocol bridging, or board-level glue logic.
- Embedded Memory-Centric Functions Use the approximately 1.55 Mbits of RAM for buffering, packet queues, or small data-store functions within an FPGA-based design.
Unique Advantages
- High Logic Density: Approximately 39,000 logic elements enable significant on-chip integration, reducing the need for external ASICs or multiple discrete devices.
- On-Chip Memory: About 1.55 Mbits of embedded RAM supports memory-heavy tasks without adding external memory components.
- Compact, Thermally-Conscious Package: 72-VFQFN exposed pad (72-QFN, 10×10) provides a small PCB footprint while allowing thermal vias to the exposed pad for heat dissipation.
- Low-Voltage Core Support: 0.95 V–1.05 V supply enables integration into modern low-voltage power domains.
- Commercial Temperature Rating: Rated 0 °C to 85 °C for standard commercial deployments.
- RoHS Compliant: Meets RoHS requirements for use in lead-free assemblies.
Why Choose LIFCL-40-8SG72C?
The LIFCL-40-8SG72C is positioned for designers who need a compact, commercially graded FPGA with substantial on-chip logic and memory capacity. With approximately 39,000 logic elements, roughly 1.55 Mbits of embedded RAM, 40 I/O pins, and a low-voltage core, it suits designs that require integrated programmable logic and local storage in a small surface-mount package.
Manufactured by Lattice Semiconductor Corporation and offered in a 72-VFQFN exposed-pad package, this device provides a balanced combination of integration density, package compactness, and commercial temperature operation for a range of system-level FPGA uses.
If you would like pricing or availability information for the LIFCL-40-8SG72C, request a quote or submit an inquiry to our sales team.