LIFCL-40-8SG72I
| Part Description |
CrossLink-NX™ Field Programmable Gate Array (FPGA) IC 40 1548288 39000 72-VFQFN Exposed Pad |
|---|---|
| Quantity | 972 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 72-QFN (10x10) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 72-VFQFN Exposed Pad | Number of I/O | 40 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 9750 | Number of Logic Elements/Cells | 39000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1548288 |
Overview of LIFCL-40-8SG72I – CrossLink-NX FPGA, 40 I/O, 72‑VFQFN
The LIFCL-40-8SG72I is a CrossLink-NX field programmable gate array (FPGA) IC from Lattice Semiconductor Corporation. It provides programmable logic capacity and on-chip memory in a compact 72‑VFQFN exposed pad package targeted at industrial applications.
With 39,000 logic elements, approximately 1.55 Mbits of embedded memory and 40 I/O pins, this device is intended for embedded designs that require a balance of logic density, memory resources and a small board footprint while operating over an industrial temperature range.
Key Features
- Core Logic 39,000 logic elements deliver programmable logic resources for custom hardware implementation and control functions.
- Embedded Memory Approximately 1.55 Mbits of on-chip RAM for data buffering, state storage and local memory requirements.
- I/O and Connectivity 40 general-purpose I/O pins provide direct interfacing to peripherals and external logic in compact systems.
- Power Core voltage supply range of 0.95 V to 1.05 V to match low-voltage system architectures.
- Package and Mounting 72‑VFQFN exposed pad (supplier package: 72‑QFN, 10×10 mm) in a surface-mount form factor for reduced PCB area and thermal solderability.
- Temperature Range Industrial operating temperature range from −40 °C to 100 °C for deployment in demanding environments.
- Environmental Compliance RoHS compliant.
Typical Applications
- Industrial Control Programmable logic and I/O consolidation for control systems and factory automation equipment operating across industrial temperature ranges.
- Sensor and I/O Aggregation Centralize sensor data handling and protocol bridging using on-chip logic and memory with 40 available I/O pins.
- Embedded System Integration Compact FPGA for custom logic implementation in space-constrained embedded modules and board-level solutions.
Unique Advantages
- Significant Logic Capacity: 39,000 logic elements enable implementation of complex custom logic and control functions without external ASICs.
- On-chip Memory: Approximately 1.55 Mbits of embedded RAM supports buffering, queues and local data storage to reduce external memory requirements.
- Compact, Thermally Managed Package: 72‑VFQFN with exposed pad and 10×10 mm QFN footprint minimizes board area while providing thermal dissipation paths.
- Industrial Temperature Rating: Operation from −40 °C to 100 °C makes the device suitable for harsh and outdoor installations.
- Low-Voltage Core: Core supply range of 0.95–1.05 V aligns with modern low-voltage system designs to help manage power.
- RoHS Compliant: Meets common environmental compliance requirements for commercial and industrial products.
Why Choose LIFCL-40-8SG72I?
The LIFCL-40-8SG72I positions itself as a compact, industrial-grade FPGA solution combining moderate-to-high logic capacity, embedded memory and a small QFN package. It is well suited for designers who need programmable logic, local RAM and a reliable thermal/temperature envelope in a surface-mount form factor.
Backed by Lattice Semiconductor Corporation, this CrossLink-NX device offers designers a scalable option for embedded industrial applications where board area, temperature performance and integration density are key considerations.
Request a quote or submit an inquiry to receive pricing and availability for the LIFCL-40-8SG72I.

Date Founded: 1983
Headquarters: Hillsboro, Oregon, USA
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