M2GL005-1FGG484T1

The M2GL005-1FGG484T1 is an IGLOO2 field programmable gate array from Microchip Technology, supplied in a 484-BGA (484-FPBGA, 23 × 23 mm) surface-mount package. It combines a flash-based FPGA architecture with an extended operating range and automotive qualification for designers building rugged, reliable embedded logic.

Targeted toward automotive and other high-reliability applications, this device provides a balance of logic capacity, embedded memory, and a high I/O count for control, signal processing, and system integration in environments that require extended temperature and qualification to AEC-Q100.

Key Features

• Logic Capacity Approximately 6,060 logic elements suitable for moderate-density custom logic, state machines, and peripheral orchestration.
• Embedded Memory Approximately 0.72 Mbits of on-chip RAM (719,872 total bits) for buffering, FIFOs, and local data storage.
• I/O Density 209 user I/O pins to support multiple interfaces, sensor buses, and peripheral connections on a single device.
• Package & Mounting 484-ball BGA in a 23 × 23 mm 484-FPBGA footprint, optimized for high-density PCB layouts and surface-mount assembly.
• Power Supply Range Operates across a wide supply window from 1.14 V to 2.625 V, enabling flexible integration with different power domains.
• Extended Temperature & Qualification Rated for −40 °C to 135 °C and AEC-Q100 qualified for automotive-grade deployment.
• Compliance RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• Automotive Electronic Control Modules Integration of custom control logic and signal conditioning in powertrain, body, and infotainment subsystems that require AEC‑Q100 qualification and extended temperature support.
• Sensor Preprocessing and Aggregation Local preprocessing of sensor data and aggregation of multiple inputs before handing off to domain controllers.
• Embedded Logic for Harsh Environments Reliable implementation of safety-related glue logic and peripheral interfacing where extended operating temperature and automotive qualification are required.

Unique Advantages

• AEC-Q100 Qualified: Qualification to AEC‑Q100 provides the documented qualification pedigree required for automotive system integration.
• High I/O Count: 209 user I/Os reduce the need for external I/O expanders and simplify board-level routing for multi-peripheral designs.
• Compact, High-Density Package: 484-BGA (23 × 23 mm) allows a high-pin-count solution in a compact footprint for space-constrained assemblies.
• Broad Supply Flexibility: A 1.14 V to 2.625 V supply range enables compatibility with different logic families and power architectures.
• Embedded Memory for Local Storage: Approximately 0.72 Mbits of on-chip RAM supports buffering and real-time data handling without external memory.
• Extended Temperature Range: Rated from −40 °C to 135 °C for operation in demanding thermal environments.

Why Choose M2GL005-1FGG484T1?

The M2GL005-1FGG484T1 delivers a practical combination of logic capacity, embedded memory, and a high I/O count in a qualified automotive package. Its flash-based IGLOO2 architecture and AEC‑Q100 qualification make it a compelling choice for designers who need reliable, low-power programmable logic in automotive and other high-reliability systems.

This device is well suited to teams building modular control electronics, sensor interfacing, or embedded logic functions where extended temperature operation, robust qualification, and compact board-level integration are priorities. The combination of on-chip resources and automotive readiness helps reduce external components and simplifies long-term deployment planning.

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