M2GL005S-1VFG400
| Part Description |
IGLOO2 Field Programmable Gate Array (FPGA) IC 169 719872 6060 400-LFBGA |
|---|---|
| Quantity | 189 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 10 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 400-VFBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 400-LFBGA | Number of I/O | 169 | Voltage | 1.14 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 6060 | Number of Logic Elements/Cells | 6060 | ||
| Number of Gates | N/A | ECCN | 5A002A1 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 719872 |
Overview of M2GL005S-1VFG400 – IGLOO2 Field Programmable Gate Array (FPGA) IC, 169 I/O, 6060 logic elements, ~0.72 Mbits RAM, 400-LFBGA
The M2GL005S-1VFG400 is an IGLOO2 Field Programmable Gate Array (FPGA) from Microchip Technology, offering a mid-range programmable logic device with defined logic capacity and embedded memory. It provides 6060 logic elements, approximately 0.72 Mbits of total on-chip RAM, and 169 user I/O pins in a 400-LFBGA package.
With a supply voltage range of 1.14 V to 2.625 V and commercial temperature grading (0 °C to 85 °C), this device is suited to designs that require moderate logic density, substantial I/O count, and compact BGA packaging for surface-mount assembly.
Key Features
- Core Logic 6060 logic elements (logic cells) provide programmable combinational and sequential resources for mid-complexity FPGA designs.
- Embedded Memory Approximately 0.72 Mbits (719,872 bits) of on-chip RAM to support buffering, small data tables, and state storage inside the FPGA fabric.
- I/O Capacity 169 user I/O pins enable interface consolidation and connectivity to multiple peripherals and external devices.
- Power Supply Flexibility Operates from 1.14 V to 2.625 V, allowing integration into a range of system power architectures.
- Package & Mounting 400-LFBGA package (supplier device package: 400-VFBGA, 17×17) in a surface-mount form factor for compact board layouts.
- Operating Conditions Commercial grade operation across 0 °C to 85 °C.
- Environmental Compliance RoHS compliant.
Typical Applications
- Embedded control and prototyping Use the programmable logic and on-chip RAM for control algorithms, state machines, and rapid hardware prototyping.
- Interface aggregation Leverage 169 I/O pins to consolidate multiple peripheral interfaces or bridge between subsystems on a single FPGA.
- Signal processing at moderate scale Implement buffering and small-scale data-paths using the embedded RAM alongside the 6060 logic elements.
Unique Advantages
- Balanced logic and memory: 6060 logic elements paired with ~0.72 Mbits of RAM support a wide range of mid-complexity designs without external memory in some use cases.
- High I/O count: 169 I/O pins enable flexible connectivity to sensors, peripherals, and system buses, reducing the need for additional interface chips.
- Compact BGA packaging: The 400-LFBGA (400-VFBGA, 17×17) surface-mount package helps save PCB area while providing robust pin density.
- Design flexibility in supply voltage: A 1.14 V to 2.625 V supply range accommodates different system power rails and design approaches.
- RoHS compliant: Meets common environmental requirements for lead-free assembly and regulatory considerations.
Why Choose M2GL005S-1VFG400?
The M2GL005S-1VFG400 situates itself as a practical IGLOO2 FPGA option for designers who need moderate programmable logic resources, significant I/O, and embedded memory in a compact BGA package. Its combination of 6060 logic elements, approximately 0.72 Mbits of on-chip RAM, and 169 I/O pins supports a broad set of embedded and interface-focused applications.
Engineers and procurement teams can rely on the clear, verifiable specifications—package, supply voltage range, operating temperature, and RoHS compliance—when planning board-level integration and assembly. The device is appropriate for commercial-grade designs where these defined capabilities meet system requirements.
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