M2GL005S-1VFG400T2

The M2GL005S-1VFG400T2 is an IGLOO2 Field Programmable Gate Array (FPGA) IC providing 6,060 logic elements and approximately 0.72 Mbits of embedded memory. It is supplied in a 400‑ball LFBGA package with 171 I/O and is available as a surface‑mount device.

This device is automotive‑grade with AEC‑Q100 qualification and an operating range of ‑40 °C to 125 °C, and supports a supply voltage range of 1.14 V to 2.625 V. It is RoHS compliant.

Key Features

• Core Logic 6,060 logic elements for implementing control, glue‑logic and custom digital functions.
• Embedded Memory Approximately 0.72 Mbits of on‑chip RAM to support data buffering, state storage and local memories.
• I/O Capacity 171 general‑purpose I/O pins to interface with sensors, actuators and external peripherals.
• Power Supply Range Flexible operation from 1.14 V to 2.625 V to accommodate a range of system power architectures.
• Package and Mounting 400‑LFBGA (supplier package: 400‑VFBGA, 17×17) in a surface‑mount form factor for compact, board‑level integration.
• Automotive Qualification & Temperature AEC‑Q100 qualified with an operating temperature range of ‑40 °C to 125 °C for demanding environmental conditions.
• Environmental Compliance RoHS compliant for lead‑free manufacturing and supply chain requirements.

Typical Applications

• Automotive electronic modules Suited for automotive systems that require AEC‑Q100 qualification and wide temperature operation while leveraging on‑chip logic and memory.
• Embedded control units Compact surface‑mount LFBGA package and 171 I/O make it appropriate for embedded designs that need moderate logic density and local RAM.
• Space‑constrained designs High I/O count and a 17×17 package footprint help integrate FPGA functionality where PCB area and routing are limited.

Unique Advantages

• Automotive‑qualified silicon: AEC‑Q100 qualification and wide operating temperature support deployment in automotive environments.
• Balanced logic and memory: 6,060 logic elements combined with approximately 0.72 Mbits of embedded RAM enable both control logic and local data storage on a single device.
• Generous I/O count: 171 I/O pins simplify system integration by reducing the need for additional interface components.
• Flexible power envelope: Support for 1.14 V to 2.625 V supplies allows compatibility with different system power rails.
• Compact, manufacturable package: 400‑LFBGA surface‑mount package supports high‑density board layouts and standard assembly processes.
• Regulatory alignment: RoHS compliance eases environmental and manufacturing requirements.

Why Choose M2GL005S-1VFG400T2?

The M2GL005S-1VFG400T2 offers a combination of moderate logic density, embedded RAM and a high I/O count in a compact 400‑LFBGA package, making it a practical choice for automotive and other temperature‑sensitive embedded applications. Its AEC‑Q100 qualification and wide operating temperature range support deployment where environmental robustness is required.

Designers seeking a surface‑mount FPGA with defined electrical and thermal characteristics, clear packaging information and compliance with RoHS will find this part suitable for systems that need on‑chip logic, memory and substantial I/O without a large form factor impact.

Request a quote or contact our sales team to discuss availability, pricing and how M2GL005S-1VFG400T2 can fit into your next design.