M2GL005S-FGG484
| Part Description |
IGLOO2 Field Programmable Gate Array (FPGA) IC 209 719872 6060 484-BGA |
|---|---|
| Quantity | 1,149 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 10 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 209 | Voltage | 1.14 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 6060 | Number of Logic Elements/Cells | 6060 | ||
| Number of Gates | N/A | ECCN | 5A002A1 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 719872 |
Overview of M2GL005S-FGG484 – IGLOO2 Field Programmable Gate Array (FPGA) IC 209 719872 6060 484-BGA
The M2GL005S-FGG484 is an IGLOO2 field programmable gate array (FPGA) from Microchip Technology, supplied in a 484-ball BGA surface-mount package. It provides a compact, commercial-grade programmable logic solution with 6,060 logic elements, approximately 0.72 Mbits of embedded memory, and 209 general-purpose I/O pins.
This device is suited to commercial electronic designs that require moderate logic capacity, substantial I/O count and on-chip memory in a small-footprint BGA. Its flexible supply voltage range and standard commercial operating temperature make it appropriate for a wide range of board-level applications.
Key Features
- Logic Capacity 6,060 logic elements deliver the core programmable resources for custom logic, glue logic, and medium-complexity designs.
- Embedded Memory Approximately 0.72 Mbits of on-chip RAM supports buffering, state machines and small data stores without external memory.
- I/O and Package 209 I/O pins in a compact 484-FPBGA (23 × 23 mm) package provide broad interfacing capability while minimizing board area; device is surface mount.
- Power Supports a supply voltage range from 1.14 V to 2.625 V, allowing integration with a variety of system power rails.
- Commercial Temperature Grade Rated for 0 °C to 85 °C operation for typical commercial deployments.
- Compliance RoHS-compliant construction meets common environmental and manufacturing requirements.
Typical Applications
- Interface and Protocol Bridging Use the device's 209 I/Os and logic capacity to implement board-level protocol conversion, bus bridging and signal adaptation functions.
- Embedded Control and Glue Logic Implement application-specific control, sequencing and peripheral interfacing without adding discrete logic components.
- Prototyping and Evaluation Deploy as a compact development or evaluation FPGA where moderate logic density and on-chip RAM are required for system validation.
Unique Advantages
- Compact BGA Footprint: The 484-FPBGA (23 × 23 mm) package delivers high I/O density in a small board area, helping reduce overall system size.
- Balanced Logic and Memory: 6,060 logic elements paired with approximately 0.72 Mbits of embedded RAM provide a practical balance for mid-range logic tasks.
- High I/O Count: 209 available I/Os enable extensive peripheral and interface connectivity without external multiplexing.
- Flexible Power Integration: A wide supply voltage window (1.14 V to 2.625 V) eases integration with common system rails and power domains.
- Commercial Grade Reliability: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial product deployments.
- Manufacturer Backing: Provided by Microchip Technology, offering established supply and manufacturing pedigree for design continuity.
Why Choose M2GL005S-FGG484?
The M2GL005S-FGG484 positions itself as a practical, space-efficient FPGA choice for commercial designs that need moderate programmable logic, a substantial I/O complement and embedded RAM in a single surface-mount BGA package. Its combination of 6,060 logic elements, approximately 0.72 Mbits of on-chip memory and 209 I/Os makes it well suited to board-level interfacing, glue logic and mid-complexity control functions.
Designed for commercial temperature environments and RoHS-compliant manufacturing, this IGLOO2 FPGA is an option for engineers seeking a compact, verified component from Microchip Technology that fits applications demanding moderate logic density and broad connectivity.
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