M2GL010-VF256I

The M2GL010-VF256I is an IGLOO2 FPGA from Microchip Technology designed for embedded logic applications that require a balance of logic capacity, on-chip memory and I/O density. It provides 12,084 logic elements and 933,888 bits of embedded RAM, packaged in a 256-LFBGA surface-mount package for compact board integration.

Targeted at industrial environments, this device supports a broad supply voltage range and an extended operating temperature, making it suitable for designs that require robust operation across varied conditions.

Key Features

• Logic Capacity — 12,084 logic elements to implement combinational and sequential logic functions.
• Embedded Memory — 933,888 bits of on-chip RAM (approximately 0.93 Mbits) for buffering, state storage and local data processing.
• I/O Resources — 138 user I/O pins to connect peripherals, sensors and external interfaces.
• Power Supply Flexibility — Operates from 1.14 V to 2.625 V to accommodate a range of supply architectures.
• Package & Mounting — 256-LFBGA package (supplier package: 256-FPBGA 14×14) in a surface-mount form factor for space-constrained PCBs.
• Industrial Temperature Range — Rated for operation from -40 °C to 100 °C for deployment in industrial environments.
• RoHS Compliant — Conforms to RoHS requirements for lead-free assembly and manufacturing.

Typical Applications

• Industrial Control — Implements custom logic and interface functions where industrial-grade temperature range and reliability are required.
• Peripheral & Sensor Interfaces — Uses the 138 I/O pins for sensor aggregation, protocol bridging and interfacing to external devices.
• Embedded Memory-Dependent Designs — Leverages approximately 0.93 Mbits of on-chip RAM for local buffering, state machines and small data queues.

Unique Advantages

• Balanced Logic and Memory — 12,084 logic elements combined with 933,888 bits of RAM provide a compact platform for mid-density FPGA designs without requiring large external memory.
• Broad Supply Range — 1.14 V to 2.625 V support enables flexible power architectures and compatibility with multiple system rails.
• High I/O Count in Compact Package — 138 I/O in a 256-LFBGA package delivers substantial connectivity while minimizing PCB footprint.
• Industrial Thermal Capability — Operation from -40 °C to 100 °C supports deployment in demanding temperature environments.
• Surface-Mount Integration — 256-LFBGA surface-mount package simplifies automated assembly and dense board layouts.
• RoHS Compliance — Simplifies compliance with lead-free manufacturing policies.

Why Choose M2GL010-VF256I?

The M2GL010-VF256I is positioned for engineers seeking a mid-density FPGA with a practical mix of logic elements, embedded memory and I/O in a compact industrial-grade package. Its documented operating range, supply flexibility and surface-mount 256-LFBGA format make it suitable for embedded systems where board space, connectivity and reliable operation across temperature extremes are important.

Backed by Microchip Technology manufacturing, this device provides a verifiable specification set for teams designing industrial and embedded applications that require defined logic capacity, on-chip RAM and a substantial number of I/O in a RoHS-compliant package.

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