M2GL010-VF256

The M2GL010-VF256 is an IGLOO2 family Field Programmable Gate Array (FPGA) in a 256-pin LFBGA package, offered in a commercial grade configuration. It provides 12,084 logic elements, approximately 0.93 Mbits of embedded memory, and 138 I/O for use in board-level digital logic and I/O-intensive designs.

With a supply voltage range of 1.14 V to 2.625 V, surface-mount packaging, and an operating temperature range of 0 °C to 85 °C, this device is targeted at commercial electronic products that require mid-density programmable logic and flexible I/O capability.

Key Features

• Core Logic: 12,084 logic elements (LEs) to implement mid-density digital logic, state machines, and custom combinational/sequential functions.
• Embedded Memory: Approximately 0.93 Mbits of on-chip RAM to support buffering, state storage, and small data tables within the FPGA fabric.
• I/O Capability: 138 I/O pins to interface with external peripherals, sensors, and buses for flexible system integration.
• Supply Voltage: Wide supply range from 1.14 V to 2.625 V to accommodate a variety of core and I/O voltage domains.
• Package & Mounting: 256-LFBGA (supplier package listed as 256-FPBGA, 14×14) in a surface-mount form factor suitable for compact board layouts.
• Temperature & Grade: Commercial grade operation over 0 °C to 85 °C for standard commercial applications.
• Regulatory: RoHS compliant for environmentally conscious designs and global supply requirements.

Typical Applications

• Embedded Control: Implement custom control logic, state machines, and timing-critical functions in commercial electronic systems using the available logic elements and embedded RAM.
• I/O-Rich Interfaces: Bridge and manage multiple external peripherals or sensors with the device’s 138 I/O pins for board-level integration.
• Data Buffering and Processing: Use the on-chip RAM for small buffering, lookup tables, and local data storage in signal processing or protocol-handling tasks.
• Compact Board Designs: The 256-LFBGA surface-mount package supports high-density PCB layouts where board space and package footprint matter.

Unique Advantages

• Balanced Logic Density: 12,084 logic elements provide a mid-level capacity that supports complex control and interface functions without excessive overcapacity.
• On-Chip Memory: Approximately 0.93 Mbits of embedded RAM reduces the need for external memory for small buffers and tables, simplifying BOM and board routing.
• Generous I/O Count: 138 I/O pins enable direct interfacing to multiple peripherals and buses, minimizing additional level-shifters or expanders.
• Flexible Power Range: A wide supply voltage window (1.14 V to 2.625 V) helps accommodate different system voltage domains and design choices.
• Compact Surface-Mount Package: The 256-LFBGA (256-FPBGA, 14×14) package supports compact designs and automated surface-mount assembly processes.
• Compliance-Ready: RoHS compliance supports environmental requirements for global commercial products.

Why Choose M2GL010-VF256?

The M2GL010-VF256 positions itself as a practical, commercial-grade mid-density FPGA solution that combines a substantial logic element count, embedded RAM, and ample I/O in a compact BGA package. It is suitable for designers seeking a balance of logic capacity, on-chip memory, and I/O flexibility for commercial electronic applications.

Its programmable fabric, combined with a wide supply voltage range and RoHS compliance, offers a straightforward path to integrate custom digital functions while keeping board-level complexity manageable. This device is well suited to customers building mid-complexity embedded systems where compact packaging and configurable logic are required.

Request a quote or submit an inquiry to get pricing and availability for the M2GL010-VF256 and support for your design needs.