M2GL010S-1TQG144T2

The M2GL010S-1TQG144T2 is an IGLOO2-series flash-based FPGA packaged in a 144‑LQFP (144‑TQFP 20×20) surface-mount package. It provides 12,084 logic elements and approximately 0.93 Mbits of embedded RAM, delivering a balance of logic capacity and on-chip memory for mid-density FPGA designs.

Designed for low-power, secure and reliable operation, this device is suited to communications, industrial, medical, defense and aviation applications where robust temperature range, automotive qualification and compact packaging are required.

Key Features

• Logic Capacity  12,084 logic elements for mid-density programmable fabric suitable for control, bridging and signal-processing tasks.
• Embedded Memory  Approximately 0.93 Mbits of on-chip RAM (933,888 bits) to support buffering, state machines and local data storage.
• I/O Density  84 user I/Os provide flexible interfacing to peripherals, PHYs and external devices in a single-package solution.
• Power Supply Range  Operates across a wide core supply range of 1.14 V to 2.625 V to accommodate varied system power architectures.
• Thermal and Environmental  Qualified for operation from −40 °C to 125 °C, supporting deployment in demanding thermal environments.
• Automotive Qualification  AEC‑Q100 qualification and automotive grade designation for designs requiring recognized automotive component qualification.
• Package and Mounting  144‑LQFP (surface mount) package (supplier device package listed as 144‑TQFP 20×20) for compact board integration.
• RoHS Compliance  Device is RoHS compliant, supporting regulatory and environmental requirements.
• IGLOO2 Series Advantages  As part of the IGLOO2 family, the device benefits from the series’ low-power architecture, proven security features and SEU-immune flash configuration described in the IGLOO2 datasheet.

Typical Applications

• Gigabit Ethernet and Networking  Use as a protocol bridge, interface controller or packet-handling engine where mid-density logic and on-chip memory are needed.
• PCIe Control Planes and Bridging  Suitable for control-plane logic and I/O expansion in systems that require compact FPGA resources from the IGLOO2 family.
• Interface Conversion and I/O Expansion  Implement level shifting, bus bridging and format conversion leveraging 84 I/Os and embedded RAM for buffering.
• System Management and Secure Connectivity  Integrate system control, boot-time logic and security-aware functions consistent with IGLOO2 series security capabilities.
• Video and Image Processing  Deploy for mid‑level video pre-processing, formatting and buffering tasks where on-chip RAM and programmable logic are beneficial.

Unique Advantages

• Automotive-Grade Reliability: AEC‑Q100 qualification and an operating range to 125 °C make the part suitable for designs requiring recognized automotive-level component qualification.
• Balanced Logic and Memory: 12,084 logic elements paired with approximately 0.93 Mbits of embedded RAM supports integrated control, buffering and protocol logic without external memory for many use cases.
• Compact, High‑I/O Package: 144‑LQFP footprint with 84 I/Os enables dense interfacing in space-constrained board layouts.
• Flexible Power Integration: Wide supply range (1.14 V to 2.625 V) helps accommodate different core-voltage schemes and power domains.
• Series-Level Low Power and Security: Benefits from IGLOO2 family attributes such as low-power architecture and on-demand security features described in the series datasheet.
• Regulatory and Environmental Compliance: RoHS compliant for environmentally conscious designs and supply-chain requirements.

Why Choose M2GL010S-1TQG144T2?

The M2GL010S-1TQG144T2 positions itself as a mid-density IGLOO2 FPGA option that combines 12,084 logic elements and nearly 1 Mbit of embedded RAM in a compact 144‑LQFP package. Its AEC‑Q100 qualification, wide supply range and extended operating temperature make it appropriate for demanding and safety-conscious applications where compact, low-power programmable logic is required.

Designers seeking a vetted IGLOO2-series device with automotive qualification, robust I/O, and integrated memory will find this part suitable for a range of communications, industrial and system-management applications where reliability and predictable thermal performance are important.

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