M2GL010TS-1VFG256T2
| Part Description |
IGLOO2 Field Programmable Gate Array (FPGA) IC 138 933888 12084 256-LFBGA |
|---|---|
| Quantity | 238 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (14x14) | Grade | Automotive | Operating Temperature | -40°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LFBGA | Number of I/O | 138 | Voltage | 1.14 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 12084 | Number of Logic Elements/Cells | 12084 | ||
| Number of Gates | N/A | ECCN | 5A002A1 | HTS Code | 8542.39.0001 | ||
| Qualification | AEC-Q100 | Total RAM Bits | 933888 |
Overview of M2GL010TS-1VFG256T2 – IGLOO2 Field Programmable Gate Array (FPGA) IC 138 I/Os, ~0.93 Mbits RAM, 12084 Logic Elements, 256-LFBGA
The M2GL010TS-1VFG256T2 is an IGLOO2 flash-based FPGA from Microchip Technology, combining programmable logic fabric with high-performance communications and memory interfaces. It targets designs that require integrated serial interfaces, on-chip memory and DSP-capable resources within a compact 256-LFBGA package.
This device is qualified to AEC‑Q100 and specified for automotive-grade use, offering wide operating temperature range and flexible I/O and power options for demanding embedded applications.
Key Features
- Logic Capacity Approximately 12,084 logic elements for implementing combinational and sequential logic functions.
- Embedded Memory Total on-chip RAM of 933,888 bits (approximately 0.93 Mbits) for data buffering, state storage and local memory requirements.
- I/O and Package 138 user I/Os in a 256-LFBGA surface-mount package (supplier package: 256-FPBGA, 14×14 mm) for dense board integration.
- Voltage Range Flexible supply support across 1.14 V to 2.625 V to accommodate different I/O levels and system power domains.
- Automotive Qualification AEC‑Q100 qualified and rated for automotive use with an operating temperature range of −40 °C to 125 °C.
- Flash-Based FPGA Architecture IGLOO2 family flash-based fabric providing non-volatile configuration and series features such as embedded DSP mathblocks and multiple memory options.
- High-Speed Interfaces (Series Capabilities) Series-level support for high-speed serial links including SERDES lanes, PCI Express, and 10 Gbps XAUI/XGMII extensions, enabling high-bandwidth communications when used in designs leveraging those IGLOO2 features.
- High-Performance Memory Subsystem (Series Capabilities) Family features include eSRAM, embedded nonvolatile memory and DDRx memory controllers for high-throughput external memory interfacing.
Typical Applications
- Automotive Systems Control, sensor aggregation and subsystem interfacing where AEC‑Q100 qualification and extended temperature range are required.
- Communications Interfaces Protocol bridging and serialization tasks that benefit from on-chip SERDES lanes and multi-standard I/Os available in the IGLOO2 family.
- Embedded Control and DSP Signal processing and algorithm acceleration using the device’s logic resources and family-level mathblocks and embedded memory.
- Memory Interfacing Local buffering and DDRx bridging solutions that leverage on-chip RAM and the family’s high-speed memory controller capabilities.
Unique Advantages
- Automotive-Qualified Platform: AEC‑Q100 qualification and −40 °C to 125 °C rating support deployment in temperature‑stress environments.
- Non-Volatile FPGA Fabric: Flash-based IGLOO2 architecture provides on-chip non-volatile configuration for simplified field management and secure deployment workflows.
- Balanced Integration: Combination of ~12k logic elements, ~0.93 Mbits RAM and 138 I/Os reduces external component count and simplifies board design.
- Flexible Power Envelope: Wide supply range (1.14 V to 2.625 V) enables compatibility with multiple I/O standards and system power domains.
- Compact Board Footprint: 256-LFBGA surface-mount package (14×14 mm supplier footprint) supports high-density PCB layouts while providing substantial I/O.
Why Choose M2GL010TS-1VFG256T2?
The M2GL010TS-1VFG256T2 pairs a sizeable logic resource pool with nearly 0.93 Mbits of on-chip RAM and 138 user I/Os in a compact, automotive‑qualified package. It is well suited for embedded systems that require durable operation across wide temperatures, flexible I/O voltage support, and the ability to integrate high-speed communications and memory interfaces from the IGLOO2 family.
Designers seeking a robust, flash-configured FPGA platform for automotive or industrial-grade applications will find the M2GL010TS-1VFG256T2 offers a practical balance of integration, configurability and series-level interface capabilities to support scalable, long-term designs.
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