M2GL010TS-1VFG256T2

IC FPGA 138 I/O 256FBGA
Part Description

IGLOO2 Field Programmable Gate Array (FPGA) IC 138 933888 12084 256-LFBGA

Quantity 238 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package256-FPBGA (14x14)GradeAutomotiveOperating Temperature-40°C – 125°C
Package / Case256-LFBGANumber of I/O138Voltage1.14 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs12084Number of Logic Elements/Cells12084
Number of GatesN/AECCN5A002A1HTS Code8542.39.0001
QualificationAEC-Q100Total RAM Bits933888

Overview of M2GL010TS-1VFG256T2 – IGLOO2 Field Programmable Gate Array (FPGA) IC 138 I/Os, ~0.93 Mbits RAM, 12084 Logic Elements, 256-LFBGA

The M2GL010TS-1VFG256T2 is an IGLOO2 flash-based FPGA from Microchip Technology, combining programmable logic fabric with high-performance communications and memory interfaces. It targets designs that require integrated serial interfaces, on-chip memory and DSP-capable resources within a compact 256-LFBGA package.

This device is qualified to AEC‑Q100 and specified for automotive-grade use, offering wide operating temperature range and flexible I/O and power options for demanding embedded applications.

Key Features

  • Logic Capacity  Approximately 12,084 logic elements for implementing combinational and sequential logic functions.
  • Embedded Memory  Total on-chip RAM of 933,888 bits (approximately 0.93 Mbits) for data buffering, state storage and local memory requirements.
  • I/O and Package  138 user I/Os in a 256-LFBGA surface-mount package (supplier package: 256-FPBGA, 14×14 mm) for dense board integration.
  • Voltage Range  Flexible supply support across 1.14 V to 2.625 V to accommodate different I/O levels and system power domains.
  • Automotive Qualification  AEC‑Q100 qualified and rated for automotive use with an operating temperature range of −40 °C to 125 °C.
  • Flash-Based FPGA Architecture  IGLOO2 family flash-based fabric providing non-volatile configuration and series features such as embedded DSP mathblocks and multiple memory options.
  • High-Speed Interfaces (Series Capabilities)  Series-level support for high-speed serial links including SERDES lanes, PCI Express, and 10 Gbps XAUI/XGMII extensions, enabling high-bandwidth communications when used in designs leveraging those IGLOO2 features.
  • High-Performance Memory Subsystem (Series Capabilities)  Family features include eSRAM, embedded nonvolatile memory and DDRx memory controllers for high-throughput external memory interfacing.

Typical Applications

  • Automotive Systems  Control, sensor aggregation and subsystem interfacing where AEC‑Q100 qualification and extended temperature range are required.
  • Communications Interfaces  Protocol bridging and serialization tasks that benefit from on-chip SERDES lanes and multi-standard I/Os available in the IGLOO2 family.
  • Embedded Control and DSP  Signal processing and algorithm acceleration using the device’s logic resources and family-level mathblocks and embedded memory.
  • Memory Interfacing  Local buffering and DDRx bridging solutions that leverage on-chip RAM and the family’s high-speed memory controller capabilities.

Unique Advantages

  • Automotive-Qualified Platform:  AEC‑Q100 qualification and −40 °C to 125 °C rating support deployment in temperature‑stress environments.
  • Non-Volatile FPGA Fabric:  Flash-based IGLOO2 architecture provides on-chip non-volatile configuration for simplified field management and secure deployment workflows.
  • Balanced Integration:  Combination of ~12k logic elements, ~0.93 Mbits RAM and 138 I/Os reduces external component count and simplifies board design.
  • Flexible Power Envelope:  Wide supply range (1.14 V to 2.625 V) enables compatibility with multiple I/O standards and system power domains.
  • Compact Board Footprint:  256-LFBGA surface-mount package (14×14 mm supplier footprint) supports high-density PCB layouts while providing substantial I/O.

Why Choose M2GL010TS-1VFG256T2?

The M2GL010TS-1VFG256T2 pairs a sizeable logic resource pool with nearly 0.93 Mbits of on-chip RAM and 138 user I/Os in a compact, automotive‑qualified package. It is well suited for embedded systems that require durable operation across wide temperatures, flexible I/O voltage support, and the ability to integrate high-speed communications and memory interfaces from the IGLOO2 family.

Designers seeking a robust, flash-configured FPGA platform for automotive or industrial-grade applications will find the M2GL010TS-1VFG256T2 offers a practical balance of integration, configurability and series-level interface capabilities to support scalable, long-term designs.

Request a quote or submit an inquiry to get pricing, availability and technical support details for the M2GL010TS-1VFG256T2.

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