M2GL025-VF256I
| Part Description |
IGLOO2 Field Programmable Gate Array (FPGA) IC 138 1130496 27696 256-LFBGA |
|---|---|
| Quantity | 130 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 10 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (14x14) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LFBGA | Number of I/O | 138 | Voltage | 1.14 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 27696 | Number of Logic Elements/Cells | 27696 | ||
| Number of Gates | N/A | ECCN | 3A991B2 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1130496 |
Overview of M2GL025-VF256I – IGLOO2 Field Programmable Gate Array (FPGA), 27,696 logic elements
The M2GL025-VF256I is an IGLOO2 Field Programmable Gate Array (FPGA) IC from Microchip Technology. It provides 27,696 logic elements and approximately 1.13 Mbits of embedded memory in a compact 256-ball LFBGA package.
Designed for industrial-grade embedded designs, this device delivers a mix of logic density, on-chip RAM, and 138 I/O in a surface-mount 256-LFBGA footprint while supporting a wide supply voltage and a broad operating temperature range.
Key Features
- Core and Logic 27,696 logic elements enable complex, reconfigurable logic implementations within the IGLOO2 architecture.
- Embedded Memory Approximately 1.13 Mbits of on-chip RAM provides storage for buffering, state machines, and local data storage.
- I/O Count 138 I/O available for interfacing with external peripherals, sensors, and memory.
- Power Supply Operates across a 1.14 V to 2.625 V supply range to accommodate different system power rails.
- Package and Mounting Supplied in a 256-LFBGA package (supplier device package: 256-FPBGA, 14×14) with surface-mount mounting for compact PCB integration.
- Industrial Temperature Range Rated for operation from −40 °C to 100 °C for reliable performance in industrial environments.
- RoHS Compliant Meets RoHS requirements for lead-free assembly and environmental compliance.
Unique Advantages
- High logic density: 27,696 logic elements provide capacity for substantial programmable logic integration, reducing the need for multiple discrete devices.
- On-chip memory: Approximately 1.13 Mbits of embedded RAM supports data buffering and state retention close to logic, lowering external memory dependencies.
- Broad I/O capability: 138 I/O pins enable flexible interfacing for mixed-signal or multi-peripheral systems.
- Wide supply range: The 1.14 V to 2.625 V operating range allows compatibility with a variety of system power configurations.
- Industrial-grade thermal tolerance: −40 °C to 100 °C operating range supports deployment in harsh or temperature-variable environments.
- Compact surface-mount package: 256-LFBGA / 256-FPBGA (14×14) packaging minimizes PCB area while supporting automated assembly.
Why Choose M2GL025-VF256I?
The M2GL025-VF256I balances significant programmable logic resources with embedded memory and a substantial I/O count in an industrial-grade FPGA package. Its combination of 27,696 logic elements, approximately 1.13 Mbits of on-chip RAM, and a 138 I/O complement make it suitable for embedded systems requiring reconfigurable logic and on-board data handling within a compact 256-ball LFBGA footprint.
With a wide supply voltage range, RoHS compliance, and an operating temperature range from −40 °C to 100 °C, the device is positioned for robust, long-term use in industrial applications where space, integration, and environmental tolerance are key considerations.
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