M2GL025TS-1FCS325I

The M2GL025TS-1FCS325I is an IGLOO2 Field Programmable Gate Array (FPGA) in a 325-TFBGA / 325-FCBGA (11×11) package. It delivers 27,696 logic elements and approximately 1.13 Mbits of embedded memory, with 180 user I/Os, making it suitable for industrial applications that require programmable logic with significant on-chip resources.

Designed for surface-mount assembly and an industrial operating range, this device supports a wide supply voltage range and RoHS compliance, enabling deployment across temperature-sensitive and space-constrained designs.

Key Features

• Logic Capacity  Provides 27,696 logic elements to implement complex combinational and sequential logic functions.
• On‑Chip Memory  Approximately 1.13 Mbits of embedded RAM for buffering, state storage, and local data processing.
• I/O Resources  180 I/O pins to support multiple interfaces, parallel buses, and mixed-signal front-end connections.
• Power and Voltage Flexibility  Operates across a supply voltage range of 1.14 V to 2.625 V to accommodate different system power domains.
• Package and Mounting  Available in a 325-TFBGA / 325-FCBGA (11×11) package; surface-mount mounting type for compact PCB integration.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Regulatory  RoHS compliant for environmental and manufacturing conformance.

Typical Applications

• Industrial Control  Use the FPGA’s 27,696 logic elements and 180 I/Os to implement control logic, I/O aggregation, and real-time processing within industrial equipment operating from −40 °C to 100 °C.
• Embedded Systems  Integrate on-chip memory and programmable logic to create application-specific acceleration and peripheral interfaces in compact surface-mount designs.
• Communications and Networking  Leverage extensive I/O and embedded RAM for protocol handling, data buffering, and custom packet processing.
• Prototyping and Custom Logic  Evaluate and implement custom logic functions and state machines using the IGLOO2 FPGA’s available logic and memory resources.

Unique Advantages

• High Logic Density: 27,696 logic elements enable implementation of complex logic and multi-function designs without external glue logic.
• Significant Embedded Memory: Approximately 1.13 Mbits of on-chip RAM reduces dependency on external memory for many buffering and state-storage needs.
• Generous I/O Count: 180 user I/Os simplify system integration by supporting multiple interfaces and direct connections to peripherals and sensors.
• Wide Supply Voltage Window: Operation from 1.14 V to 2.625 V provides flexibility for different board power architectures.
• Industrial Temperature Capability: Rated from −40 °C to 100 °C for reliable operation in temperature-challenging environments.
• Compact Surface-Mount Package: 325-FCBGA (11×11) packaging supports dense PCB layouts while maintaining the device’s resource set.

Why Choose M2GL025TS-1FCS325I?

The M2GL025TS-1FCS325I IGLOO2 FPGA combines substantial logic capacity, embedded memory, and a high I/O count in a compact 325-FCBGA package, packaged and rated for industrial operation. These attributes make it well suited for engineers designing industrial control, embedded processing, and communications systems that need a programmable, on-board logic solution.

With a broad supply voltage range and RoHS compliance, this device offers flexibility for varied power architectures and regulatory environments, enabling scalable designs that benefit from integrated logic and memory resources.

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