M2GL025TS-1FCSG325

The M2GL025TS-1FCSG325 is an IGLOO2 Field Programmable Gate Array (FPGA) IC from Microchip Technology. It provides a configurable logic fabric with on-chip embedded memory and a substantial I/O count, packaged in a compact 325-ball FCBGA/TFBGA package.

This device is suited for designs that require mid-range logic capacity, embedded RAM, and flexible I/O in a commercial-temperature, surface-mount form factor.

Key Features

• Core Logic  Approximately 27,696 logic elements for implementing custom digital logic and state machines.
• Embedded Memory  Approximately 1.13 Mbits of on-chip RAM to support buffering, lookup tables, and small data stores.
• I/O Count  180 user I/O pins to interface with external peripherals, sensors, and buses.
• Power  Flexible supply range from 1.14 V to 2.625 V to accommodate varied voltage domains and low-power designs.
• Package & Mounting  325-TFBGA / 325-FCBGA (11 × 11) surface-mount package for compact board-level integration.
• Operating Range  Commercial grade operation from 0 °C to 85 °C suitable for standard consumer and industrial environments.
• Compliance  RoHS compliant, meeting common lead-free material requirements for modern assembly processes.

Typical Applications

• Embedded Systems and Control  Use the device’s ~27,696 logic elements and ~1.13 Mbits of RAM to implement custom control logic, protocol bridging, and finite-state machines in embedded controllers.
• Interface and I/O Expansion  Leverage 180 I/O pins to add parallel or serial interfaces, glue logic, and sensor conditioning to larger systems.
• Communications and Data Path Processing  Deploy on-chip RAM and programmable logic to implement buffering, framing, and custom packet processing functions.
• Prototyping and Evaluation  The surface-mount 325-ball package and commercial temperature rating make the device suitable for board-level prototypes and development platforms.

Unique Advantages

• Balanced Logic and Memory: Combines approximately 27,696 logic elements with roughly 1.13 Mbits of embedded RAM to handle moderate-complexity digital designs without external memory.
• High I/O Density: 180 I/O pins provide flexibility for multi-bus connectivity and peripheral interfacing, reducing the need for additional interface ICs.
• Compact Package: The 325-TFBGA / 325-FCBGA (11 × 11) footprint supports space-constrained PCBs while maintaining robust routing options.
• Flexible Power Envelope: Wide supply range (1.14 V–2.625 V) allows integration into systems with differing voltage rails and power-optimization strategies.
• RoHS Compliant: Meets lead-free assembly requirements for modern manufacturing processes.
• Commercial Temperature Rating: Rated for 0 °C to 85 °C operation for use in standard consumer and industrial applications.

Why Choose M2GL025TS-1FCSG325?

The M2GL025TS-1FCSG325 delivers a practical balance of logic capacity, embedded memory, and I/O density in a compact 325-ball BGA package from Microchip Technology. Its voltage flexibility and commercial temperature rating make it a fit for designers building mid-range configurable systems that require on-chip resources and board-level integration efficiency.

This device is well suited for engineers and procurement teams looking for a configurable FPGA option that combines moderate logic density, sizable embedded RAM, and numerous I/Os in a surface-mount form factor with RoHS compliance and manufacturer backing.

Request a quote or contact sales to discuss availability, lead times, and pricing for the M2GL025TS-1FCSG325.