M2GL050-FGG896

The M2GL050-FGG896 is an IGLOO2 field programmable gate array (FPGA) IC from Microchip Technology designed for programmable-logic integration in electronic designs. It combines a high logic element count, substantial on-chip memory, and a large I/O complement in a compact ball-grid array package.

This device targets applications that require significant combinational and sequential logic capacity, abundant embedded memory, and extensive I/O—all within a surface-mount 896-BGA footprint and a commercial operating temperature range.

Key Features

• Logic Capacity  Approximately 56,340 logic elements for implementing complex user logic and state machines.
• Embedded Memory  Approximately 1.87 Mbits of on-chip RAM to support buffering, look-up tables and data storage requirements.
• I/O  377 user I/O pins to support high-pin-count interfacing and dense peripheral connectivity.
• Power  Flexible supply range from 1.14 V to 2.625 V to accommodate a variety of core and I/O voltage architectures.
• Package & Mounting  896-ball BGA (896-FBGA, 31×31 mm) in a surface-mount form factor for high-density board designs.
• Operating Range & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Custom Programmable Logic  Implement application-specific logic and glue functions where a high count of logic elements and on-chip RAM are required.
• High-Density I/O Systems  Large I/O count supports designs that consolidate multiple peripheral interfaces and implement extensive signal routing.
• Embedded Memory-Dependent Designs  Approximately 1.87 Mbits of embedded RAM for buffering, packet handling, and local data storage in embedded systems.
• Compact Board-Level Integration  896-BGA package enables a compact footprint for space-constrained, surface-mount PCB layouts.

Unique Advantages

• High Logic Density:  56,340 logic elements provide substantial capacity for complex logic integration without external programmable devices.
• Significant On-Chip Memory:  Approximately 1.87 Mbits of RAM reduces dependence on external memory for many buffering and storage tasks.
• Extensive I/O:  377 I/O pins allow broad peripheral connectivity and signal routing directly to the FPGA fabric.
• Compact, High-Pin Package:  896-FBGA (31×31) enables a high-pin-count solution in a compact surface-mount form factor suitable for dense layouts.
• Flexible Power Options:  Wide supply range (1.14 V–2.625 V) supports integration with various voltage domains.
• RoHS Compliant:  Meets RoHS environmental requirements for regulatory compliance in applicable markets.

Why Choose M2GL050-FGG896?

The M2GL050-FGG896 positions itself as a high-capacity, memory-rich FPGA option for designers who need to consolidate logic, handle substantial on-chip data, and interface with a large number of signals. Its combination of roughly 56k logic elements, approximately 1.87 Mbits of embedded RAM, and 377 I/Os makes it suitable for complex board-level integration where space and pin count are factors.

Backed by Microchip Technology and delivered in a compact 896-FBGA surface-mount package, this commercial-grade FPGA is aimed at embedded and electronic design teams seeking a scalable programmable-logic building block with flexible voltage support and RoHS compliance.

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