M2GL050-FG896I

IC FPGA 377 I/O 896FBGA
Part Description

IGLOO2 Field Programmable Gate Array (FPGA) IC 377 1869824 56340 896-BGA

Quantity 1,227 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package896-FBGA (31x31)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case896-BGANumber of I/O377Voltage1.14 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs56340Number of Logic Elements/Cells56340
Number of GatesN/AECCN3A991B2HTS Code8542.39.0001
QualificationN/ATotal RAM Bits1869824

Overview of M2GL050-FG896I – IGLOO2 Field Programmable Gate Array (FPGA) IC 377 1869824 56340 896-BGA

The M2GL050-FG896I is an IGLOO2 field programmable gate array (FPGA) from Microchip Technology, provided in a 896-ball BGA package for surface-mount applications. It combines substantial logic capacity, embedded memory and a high I/O count in an industrial-grade device.

Key on-chip resources include 56,340 logic elements, approximately 1.87 Mbits of embedded memory and 377 I/O pins. The device supports a supply voltage range of 1.14 V to 2.625 V and operates across an industrial temperature range of −40 °C to 100 °C, with RoHS compliance for environmental requirements.

Key Features

  • Core Logic 56,340 logic elements provide significant programmable logic capacity for medium to complex designs.
  • Embedded Memory Approximately 1.87 Mbits of on-chip RAM to support buffering, state storage and local data processing.
  • I/O Density 377 user I/O pins to accommodate multiple interfaces, GPIO and peripheral connections.
  • Power Supply Operates from 1.14 V to 2.625 V, enabling integration into a range of power domain architectures.
  • Package & Mounting 896-ball BGA (Supplier device package: 896-FBGA, 31×31) in a surface-mount form factor for compact board layouts.
  • Temperature & Grade Industrial-grade device rated for operation from −40 °C to 100 °C for deployment in demanding environments.
  • Environmental Compliance RoHS compliant to meet common environmental and materials requirements.

Unique Advantages

  • High logic capacity: 56,340 logic elements enable implementation of substantial custom logic without external FPGA resources.
  • Significant embedded memory: Approximately 1.87 Mbits of on-chip RAM reduces dependence on off-chip memory for many data buffering and processing tasks.
  • Broad I/O support: 377 I/O pins allow flexible interfacing with peripherals, sensors and external controllers.
  • Industrial operation: Rated for −40 °C to 100 °C, suitable for applications that require wide temperature tolerance.
  • Compact surface-mount package: 896-FBGA (31×31) provides a high-density option for board designs with constrained PCB area.
  • Flexible power integration: Wide supply range (1.14 V to 2.625 V) supports diverse power architectures and voltage domains.

Why Choose M2GL050-FG896I?

The M2GL050-FG896I positions itself as an industrial-grade FPGA option that balances sizable logic and memory resources with a high I/O count and a compact BGA footprint. Its electrical and thermal specifications make it a practical choice for engineers building robust, space-conscious systems that require on-chip programmability.

Designed and manufactured by Microchip Technology, this IGLOO2 FPGA is well suited for projects that need integrated logic capacity, embedded RAM and broad I/O in an industrial-temperature package, while maintaining compliance with RoHS requirements.

Request a quote or submit an inquiry today to obtain pricing and availability for the M2GL050-FG896I.

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