M2GL050-FG896I
| Part Description |
IGLOO2 Field Programmable Gate Array (FPGA) IC 377 1869824 56340 896-BGA |
|---|---|
| Quantity | 1,227 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 896-FBGA (31x31) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 896-BGA | Number of I/O | 377 | Voltage | 1.14 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 56340 | Number of Logic Elements/Cells | 56340 | ||
| Number of Gates | N/A | ECCN | 3A991B2 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1869824 |
Overview of M2GL050-FG896I – IGLOO2 Field Programmable Gate Array (FPGA) IC 377 1869824 56340 896-BGA
The M2GL050-FG896I is an IGLOO2 field programmable gate array (FPGA) from Microchip Technology, provided in a 896-ball BGA package for surface-mount applications. It combines substantial logic capacity, embedded memory and a high I/O count in an industrial-grade device.
Key on-chip resources include 56,340 logic elements, approximately 1.87 Mbits of embedded memory and 377 I/O pins. The device supports a supply voltage range of 1.14 V to 2.625 V and operates across an industrial temperature range of −40 °C to 100 °C, with RoHS compliance for environmental requirements.
Key Features
- Core Logic 56,340 logic elements provide significant programmable logic capacity for medium to complex designs.
- Embedded Memory Approximately 1.87 Mbits of on-chip RAM to support buffering, state storage and local data processing.
- I/O Density 377 user I/O pins to accommodate multiple interfaces, GPIO and peripheral connections.
- Power Supply Operates from 1.14 V to 2.625 V, enabling integration into a range of power domain architectures.
- Package & Mounting 896-ball BGA (Supplier device package: 896-FBGA, 31×31) in a surface-mount form factor for compact board layouts.
- Temperature & Grade Industrial-grade device rated for operation from −40 °C to 100 °C for deployment in demanding environments.
- Environmental Compliance RoHS compliant to meet common environmental and materials requirements.
Unique Advantages
- High logic capacity: 56,340 logic elements enable implementation of substantial custom logic without external FPGA resources.
- Significant embedded memory: Approximately 1.87 Mbits of on-chip RAM reduces dependence on off-chip memory for many data buffering and processing tasks.
- Broad I/O support: 377 I/O pins allow flexible interfacing with peripherals, sensors and external controllers.
- Industrial operation: Rated for −40 °C to 100 °C, suitable for applications that require wide temperature tolerance.
- Compact surface-mount package: 896-FBGA (31×31) provides a high-density option for board designs with constrained PCB area.
- Flexible power integration: Wide supply range (1.14 V to 2.625 V) supports diverse power architectures and voltage domains.
Why Choose M2GL050-FG896I?
The M2GL050-FG896I positions itself as an industrial-grade FPGA option that balances sizable logic and memory resources with a high I/O count and a compact BGA footprint. Its electrical and thermal specifications make it a practical choice for engineers building robust, space-conscious systems that require on-chip programmability.
Designed and manufactured by Microchip Technology, this IGLOO2 FPGA is well suited for projects that need integrated logic capacity, embedded RAM and broad I/O in an industrial-temperature package, while maintaining compliance with RoHS requirements.
Request a quote or submit an inquiry today to obtain pricing and availability for the M2GL050-FG896I.

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