M2GL050-FCSG325I

The M2GL050-FCSG325I is an IGLOO2 Field Programmable Gate Array (FPGA) IC designed for industrial applications. It combines a substantial logic fabric with embedded on-chip memory and a broad I/O count in a compact BGA package.

With 56,340 logic elements, approximately 1.87 Mbits of embedded memory, and 200 user I/O pins, this device is suited for designs that require integration of programmable logic, moderate embedded storage, and a high number of external interfaces within industrial temperature and surface-mount packaging constraints.

Key Features

• Logic Capacity — 56,340 logic elements provide substantial programmable logic resources for implementing custom digital functions.
• Embedded Memory — Approximately 1.87 Mbits of on-chip RAM to support buffering, state storage, and memory-intensive logic blocks.
• I/O — 200 user I/O pins enable connectivity to peripherals, sensors, and external logic.
• Power Supply Range — Operates from 1.14 V to 2.625 V to accommodate a range of core and I/O voltage domains.
• Package and Mounting — 325-TFBGA / 325-FCBGA (11 × 11 mm) surface-mount package for compact board-level integration.
• Industrial Temperature — Rated for operation from −40°C to 100°C, suitable for industrial environments.
• Compliance — RoHS compliant, meeting common environmental substance requirements.

Unique Advantages

• High logic density: 56,340 logic elements allow implementation of complex control, processing, and glue-logic functions without external ASICs.
• Integrated embedded memory: Approximately 1.87 Mbits of on-chip RAM reduces the need for external memory for many control and buffering tasks.
• Broad I/O capability: 200 I/O pins provide flexible interfacing options to support multiple peripherals and signals directly from the FPGA.
• Wide supply flexibility: A core/I/O supply range of 1.14 V to 2.625 V supports varied voltage domains and system architectures.
• Industrial-grade packaging and temperature range: Surface-mount 325-FCBGA package and −40°C to 100°C rating support deployment in industrial board designs.
• Regulatory alignment: RoHS compliance supports environmentally conscious product builds and global manufacturing requirements.

Why Choose M2GL050-FCSG325I?

The M2GL050-FCSG325I offers a balanced combination of logic resources, embedded memory, and I/O capacity in a compact BGA package designed for industrial temperature environments. It is suitable for engineers and procurement teams seeking a programmable logic device that integrates multiple system functions while minimizing board-level footprint.

This FPGA is appropriate for designs that require scalable programmable logic, on-chip storage, and substantial external connectivity, with RoHS compliance and surface-mount packaging that align with standard manufacturing processes.

Request a quote or submit a sales inquiry for the M2GL050-FCSG325I to obtain pricing, lead-time, and availability information.