M2GL050-FCS325I

The M2GL050-FCS325I is an IGLOO2 field programmable gate array (FPGA) designed for industrial embedded applications. It provides a fabric of 56,340 logic elements with approximately 1.87 Mbits of embedded memory and 200 user I/O pins to implement custom digital functions and system glue logic.

With a wide supply voltage range and an industrial operating temperature range, this surface-mount FPGA is suited to designs that require on-chip memory and flexible I/O in a 325-ball FCBGA package.

Key Features

• Logic Capacity  56,340 logic elements for implementing complex combinational and sequential logic structures.
• Embedded Memory  Approximately 1.87 Mbits of on-chip RAM to support frame buffering, state machines, FIFOs and other data storage needs.
• I/O Resources  200 user I/O pins providing extensive connectivity options for peripherals, sensors, and external interfaces.
• Power Supply Flexibility  Supports a supply voltage range from 1.14 V to 2.625 V, enabling use with varied system power domains.
• Package & Mounting  Available in a 325-TFBGA / 325-FCBGA (11×11) surface-mount package for compact board integration.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C, suitable for demanding environmental conditions.
• Compliance  RoHS compliant for environmental and regulatory compatibility.

Typical Applications

• Industrial Control and Automation  Implements custom control logic, sensor aggregation, and interface bridging while meeting industrial temperature and mounting requirements.
• Embedded Systems  Acts as a reconfigurable processing element or system glue for embedded platforms requiring on-chip memory and extensive I/O.
• Communication Interfaces  Handles protocol conversion, timing control and parallel/serial interfacing using available logic and I/O resources.

Unique Advantages

• High Logic Density:  56,340 logic elements enable implementation of substantial custom logic without external ASICs or CPLDs.
• Integrated Memory:  Approximately 1.87 Mbits of embedded RAM reduces reliance on external memory for many buffering and state-machine tasks.
• Extensive I/O Count:  200 I/O pins provide direct connectivity to peripherals and sensors, simplifying PCB routing and BOM.
• Wide Supply Range:  Support for 1.14 V to 2.625 V offers flexibility to operate within different system power architectures.
• Industrial Reliability:  −40 °C to 100 °C operating range and surface-mount 325-ball FCBGA packaging support deployment in industrial environments.
• Regulatory Compliance:  RoHS compliance helps meet environmental and manufacturing requirements.

Why Choose M2GL050-FCS325I?

The M2GL050-FCS325I positions itself as a versatile industrial-grade FPGA offering substantial logic capacity, on-chip memory, and plentiful I/O in a compact 325-ball FCBGA package. Its supply voltage flexibility and wide operating temperature range make it appropriate for embedded and industrial designs that require reconfigurable logic and robust operation.

This device is well suited to engineers and integrators building mid- to high-complexity digital systems who prioritize integration, configurability, and predictable environmental performance. The combination of logic elements, embedded RAM and I/O pin count supports scalable designs while minimizing external component needs.

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