M2GL050-FG484
| Part Description |
IGLOO2 Field Programmable Gate Array (FPGA) IC 267 1869824 56340 484-BGA |
|---|---|
| Quantity | 499 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 267 | Voltage | 1.14 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 56340 | Number of Logic Elements/Cells | 56340 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1869824 |
Overview of M2GL050-FG484 – IGLOO2 FPGA 484-BGA
The M2GL050-FG484 is an IGLOO2 flash-based Field Programmable Gate Array (FPGA) from Microchip Technology in a 484-FPBGA (23×23) package. This device offers 56,340 logic elements, approximately 1.87 Mbits of embedded memory, and 267 user I/Os, making it suitable for systems that require programmable logic with integrated high-performance communication and memory interfaces.
Designed for commercial temperature operation (0 °C to 85 °C) with a wide supply range (1.14 V to 2.625 V) and RoHS compliance, the M2GL050-FG484 targets applications that need a balance of integration, I/O density, and configurable on-chip resources.
Key Features
- Core Logic 56,340 logic elements implemented in IGLOO2's 4-input LUT fabric with carry chains for efficient combinational and arithmetic logic.
- Embedded Memory Approximately 1.87 Mbits of on-chip RAM with family-level support for large dual-port SRAM blocks and micro SRAM arrays for high-performance buffering and storage.
- High-Speed Serial & Protocol Interfaces Family-level support includes up to 16 SERDES lanes, 10 Gbps XAUI/XGXS capability and PCI Express endpoint cores (x1/x2/x4) for high-bandwidth serial connectivity.
- High-Speed Memory Controllers Family-level DDRx controllers (supporting LPDDR/DDR2/DDR3) and SDRAM soft controller options enable external memory interfaces with command and data reordering features.
- DSP Resources Family mathblock resources support signed and unsigned multiplications and wide accumulators for DSP and signal-processing tasks.
- Clocking and PLLs Multiple clock sources and up to eight Clock Conditioning Circuits (CCCs) with integrated PLLs provide flexible clock generation and phase control across the design.
- Security and Device Integrity Family-level design-security features include encrypted bitstream loading, device certificate supply-chain assurance, anti-tamper options, and premium-device cryptographic services such as AES-256 and SHA-256.
- Package and Mounting 484-FPBGA (23×23) surface-mount package offering high I/O density (267 I/Os) for compact board-level integration.
- Commercial Temperature & Power Rated for 0 °C to 85 °C operation and a supply range of 1.14 V to 2.625 V to accommodate a variety of system power domains.
Typical Applications
- High-speed networking and connectivity Implement protocol bridges, PCIe endpoints or 10 Gbps interfaces using the device's SERDES lanes and PCI Express support.
- Embedded memory controllers and buffering Use the integrated memory resources and DDRx controller family features for systems that require external DRAM interfacing and on-chip buffering.
- DSP and signal processing Deploy mathblocks and abundant logic elements for acceleration of filtering, transforms, and other numeric algorithms.
- Secure programmable logic Leverage encrypted bitstream loading and available cryptographic services for applications that require protection of IP and data integrity.
Unique Advantages
- High logic and I/O density: 56,340 logic elements and 267 I/Os in a 484-FPBGA package provide ample fabric and connectivity for complex designs without large board area.
- Integrated memory architecture: Approximately 1.87 Mbits of embedded RAM plus family support for multiple SRAM block configurations reduce reliance on external buffering for many use cases.
- Flexible high-speed interfaces: Family-level SERDES, PCIe and XAUI/XGXS capabilities simplify implementation of high-bandwidth data paths and protocol endpoints.
- Security-enabled platform: On-chip security features and optional cryptographic services help protect intellectual property and secure boot/bitstream workflows.
- Commercial temperature and RoHS compliance: Rated for 0 °C to 85 °C and RoHS compliant to meet standard commercial product requirements.
- Surface-mount 484-BGA packaging: The 23×23 FPBGA package combines high pin-count with compact board footprint for dense system designs.
Why Choose M2GL050-FG484?
The M2GL050-FG484 delivers a balance of programmable logic capacity, on-chip memory, and high-speed interface options in a compact 484-FPBGA package. It is well suited to designers who need integrated serial connectivity, DDR memory interfacing, DSP acceleration, and configurable security features within a commercial-temperature FPGA.
This device is appropriate for projects requiring a flash-based FPGA fabric with substantial logic resources and a broad voltage supply range, enabling flexible integration into a range of embedded and communications designs while maintaining RoHS compliance.
Request a quote or submit an inquiry to discuss availability, lead times, and pricing for the M2GL050-FG484. Our team can provide ordering and technical details to support your design evaluation and procurement process.

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