M2GL050TS-FGG896
| Part Description |
IGLOO2 Field Programmable Gate Array (FPGA) IC 377 1869824 56340 896-BGA |
|---|---|
| Quantity | 1,202 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 896-FBGA (31x31) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 896-BGA | Number of I/O | 377 | Voltage | 1.14 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 56340 | Number of Logic Elements/Cells | 56340 | ||
| Number of Gates | N/A | ECCN | 3A991B2 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1869824 |
Overview of M2GL050TS-FGG896 – IGLOO2 FPGA, 56,340 Logic Elements, 377 I/O, 896-BGA
The M2GL050TS-FGG896 is an IGLOO2 Field Programmable Gate Array (FPGA) from Microchip Technology. It combines a high logic capacity with embedded memory and extensive I/O in a surface-mount 896-BGA package.
With 56,340 logic elements, approximately 1.87 Mbits of embedded memory and 377 I/O pins, this device is suited to applications that require programmable logic density, substantial on-chip RAM and flexible interfacing while operating across a commercial temperature range.
Key Features
- Core Capacity 56,340 logic elements provide substantial programmable logic resources for complex, custom digital functions.
- Embedded Memory Approximately 1.87 Mbits of on-chip RAM support local buffering, data storage and state retention without external memory.
- I/O Resources 377 general-purpose I/O pins enable wide peripheral connectivity and parallel interfacing options.
- Power and Voltage Supports a supply voltage range from 1.14 V to 2.625 V for flexible power-architecture integration.
- Package & Mounting 896-BGA package (supplier device package: 896-FBGA (31×31)) in a surface-mount form factor for high-pin-density board designs.
- Temperature & Grade Commercial-grade operation across 0 °C to 85 °C for standard embedded and consumer applications.
- Environmental Compliance RoHS compliant to meet common environmental and manufacturing requirements.
Typical Applications
- Prototyping and Development Use the device for proof-of-concept designs and FPGA-based prototypes that need substantial logic density and on-chip memory.
- Embedded System Control Implement custom control logic and data handling functions that benefit from local RAM and many I/O connections.
- I/O-Intensive Interfaces Deploy as an interface bridge or protocol converter where a high count of I/O pins is required for parallel or multi-channel signals.
Unique Advantages
- Dense Programmable Logic: 56,340 logic elements provide the capacity to implement complex digital designs without partitioning across multiple devices.
- Significant On-Chip Memory: Approximately 1.87 Mbits of embedded RAM reduce dependence on external memory and simplify board layout.
- Extensive I/O Count: 377 I/O pins enable broad connectivity options for sensors, peripherals and parallel interfaces.
- High-Pin-Count BGA Package: The 896-BGA (896-FBGA (31×31)) delivers a compact footprint with high I/O density for space-constrained PCBs.
- Flexible Power Range: Operation across 1.14 V to 2.625 V supports integration with varied power domains and design choices.
- RoHS Compliant: Meets common environmental compliance requirements for modern electronics manufacturing.
Why Choose M2GL050TS-FGG896?
The M2GL050TS-FGG896 positions itself as a capable IGLOO2 FPGA option for designs that require a balance of logic capacity, embedded memory and abundant I/O in a compact surface-mount package. Its commercial temperature rating and RoHS compliance make it suitable for standard embedded and consumer applications where reliability and regulatory conformance are important.
This device is ideal for engineers and procurement teams building systems that benefit from integrated memory and high I/O density while maintaining a small board footprint. Detailed technical characteristics and implementation guidance are available in the manufacturer's documentation to support design integration and validation.
Request a quote or submit an inquiry to receive pricing and availability information for the M2GL050TS-FGG896 from Microchip Technology.

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