M2GL060T-1FGG676I

The M2GL060T-1FGG676I is an IGLOO2 field programmable gate array (FPGA) from Microchip Technology, delivered in a 676-ball BGA package. It provides a mid-to-high logic density FPGA option with a combination of logic resources, embedded memory, and a large I/O count suitable for industrial embedded designs.

Designed for applications that require on-board configurability and robust operating ranges, this device offers approximately 56,520 logic elements, about 1.87 Mbits of embedded RAM, and up to 387 I/Os, while supporting a wide supply voltage range and industrial temperature operation.

Key Features

• Core Logic Approximately 56,520 logic elements for implementing complex digital logic, custom peripherals and state machines.
• Embedded Memory Approximately 1.87 Mbits of on-chip RAM suitable for buffering, FIFOs and small data stores.
• I/O Capacity Up to 387 I/Os to support flexible interfacing with sensors, peripherals and external devices.
• Power Supply Range Supports a wide voltage supply range from 1.14 V to 2.625 V to accommodate different system power rails and I/O standards.
• Package & Mounting 676-FBGA (27×27) package in a surface-mount form factor for high-density board designs.
• Industrial Temperature Range Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Regulatory Compliance RoHS compliant to meet environmental and manufacturing requirements.

Typical Applications

• Industrial Control & Automation Implement custom control logic, motor interfaces and real-time processing using the device’s logic density and wide operating temperature range.
• Embedded Processing & Peripherals Create custom data paths, protocol bridges and peripheral controllers leveraging the on-chip RAM and extensive I/O count.
• Networking & Communications Develop interface logic and packet handling functions that benefit from reprogrammable logic and plentiful I/O resources.

Unique Advantages

• High Logic Capacity: Approximately 56,520 logic elements allow consolidation of multiple functions into a single device, reducing component count.
• On-Chip Memory: Roughly 1.87 Mbits of embedded RAM supports buffering and temporary data storage without external memory.
• Extensive I/O: Up to 387 I/Os enable flexible connectivity for dense peripheral and sensor interfacing.
• Wide Supply Range: Operates from 1.14 V to 2.625 V to accommodate a variety of system power architectures.
• Industrial Reliability: Rated for −40 °C to 100 °C operation and supplied in a compact 676-FBGA package for reliable use in industrial environments.
• RoHS Compliant: Meets environmental manufacturing requirements for lead-free assembly.

Why Choose M2GL060T-1FGG676I?

The M2GL060T-1FGG676I IGLOO2 FPGA balances significant logic capacity, embedded memory and high I/O density in a compact 676-FBGA package, making it well-suited for industrial embedded designs that demand configurability and durable operation. Its wide voltage support and −40 °C to 100 °C operating range make it appropriate for deployments where environmental and power flexibility are important.

This device is a practical choice for engineers seeking a reprogrammable, integrative solution to consolidate digital functions, implement custom interfaces and adapt designs in the field while maintaining compliance with RoHS manufacturing requirements.

Request a quote or submit a purchase inquiry today to discuss pricing and availability for the M2GL060T-1FGG676I.