M2GL060T-1FGG676

The M2GL060T-1FGG676 is an IGLOO2 Field Programmable Gate Array (FPGA) offered in a 676-ball BGA package. It provides a dense logic fabric with 56,520 logic elements, approximately 1.87 Mbits of embedded memory and up to 387 user I/O, making it suitable for designs that require significant on-chip logic and flexible I/O.

Designed for surface-mount assembly and commercial-temperature operation (0 °C to 85 °C), this device supports a voltage supply range of 1.14 V to 2.625 V and is RoHS compliant.

Key Features

• Logic Capacity 56,520 logic elements to implement complex programmable logic and custom functions.
• Embedded Memory Approximately 1.87 Mbits of on-chip RAM for buffering, state storage, and local data processing.
• I/O Resources Up to 387 user I/O pins to connect multiple peripherals, sensors, or high-density interfaces.
• Power and Voltage Supported supply range from 1.14 V to 2.625 V to match a variety of system power rails and signaling domains.
• Package & Mounting 676-ball FBGA (27 × 27) package, surface-mountable for compact board layouts and high-density PCBs.
• Operating Grade and Temperature Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance RoHS compliant for lead-free manufacturing processes.

Typical Applications

• I/O-intensive systems — Use the 387 available I/O pins for aggregating sensors, parallel interfaces, or multi-channel I/O fabrics in compact designs.
• Embedded logic and controllers — Implement custom control logic, state machines, and glue logic using the 56,520 logic elements and on-chip RAM.
• Data buffering and preprocessing — Leverage approximately 1.87 Mbits of embedded memory for packet buffering, FIFO implementations, or local data staging ahead of a host processor.

Unique Advantages

• High logic density: 56,520 logic elements enable substantial on-chip integration of custom logic and control functions, reducing external component count.
• Substantial embedded memory: Approximately 1.87 Mbits of RAM supports localized buffering and temporary data storage without relying on external memory.
• Extensive I/O: 387 user I/O pins accommodate multiple interfaces and high-pin-count peripherals in a single device.
• Flexible supply range: Operation from 1.14 V to 2.625 V allows integration into systems with varied voltage domains.
• Compact, manufacturable package: 676-FBGA (27 × 27) surface-mount package supports high-density PCB designs and automated assembly.
• RoHS compliant: Meets lead-free manufacturing requirements for environmentally conscious production.

Why Choose M2GL060T-1FGG676?

The M2GL060T-1FGG676 IGLOO2 FPGA combines a large logic array, meaningful embedded memory, and a high I/O count in a compact 676-FBGA package, making it a strong fit for designs that need on-chip integration of control, buffering, and interfacing. Its commercial-grade temperature rating and flexible supply range support a wide range of board-level applications.

This device is suited to engineers and procurement teams seeking a programmable logic solution that balances logic capacity, memory resources, and I/O density while maintaining RoHS compliance for modern manufacturing flows.

Request a quote or submit your RFQ today to get pricing and availability for the M2GL060T-1FGG676 IGLOO2 FPGA.