M2GL060T-1FG676I

The M2GL060T-1FG676I is an IGLOO2 Field Programmable Gate Array (FPGA) from Microchip Technology. It provides a configurable digital fabric with 56,520 logic elements and approximately 1.87 Mbits of embedded memory for implementing custom digital logic.

Designed as an industrial-grade, surface-mount device in a 676-FBGA (27×27) package, this FPGA offers a wide I/O count and a flexible voltage supply range suitable for deployments that require robust temperature and power-range tolerance.

Key Features

• Logic Capacity 56,520 logic elements to implement complex user-defined digital functions and state machines.
• Embedded Memory Approximately 1.87 Mbits of on-chip RAM to store configuration data, buffers, and small lookup tables.
• I/O Density 387 I/O pins to support multiple interfaces, parallel buses, and extensive external connectivity.
• Package and Mounting 676-BGA (supplier package: 676-FBGA 27×27) surface-mount package for compact board-level integration.
• Power Supply Range Operates from 1.14 V to 2.625 V to accommodate a range of core and I/O voltage domains.
• Industrial Temperature Range Rated for operation from −40 °C to 100 °C for use in temperature-challenging environments.
• Regulatory Compliance RoHS compliant.

Typical Applications

• Industrial control and automation — Suitable for control logic and interface aggregation where industrial temperature tolerance and high I/O counts are required.
• High-density I/O systems — 387 I/Os support complex interface bridging, multi-channel I/O routing, and system-level glue logic.
• Compact board-level FPGA integration — 676-FBGA surface-mount package enables space-efficient placement in constrained PCB designs.

Unique Advantages

• High logic capacity: 56,520 logic elements provide substantial resources for custom digital designs.
• Significant on-chip memory: Approximately 1.87 Mbits of embedded RAM reduces reliance on external memory for buffers and small data sets.
• Extensive I/O availability: 387 I/Os enable broad external connectivity without additional interface chips.
• Wide operating temperature: −40 °C to 100 °C supports deployment in industrial environments.
• Flexible voltage operation: 1.14 V to 2.625 V supply range accommodates diverse system power architectures.
• Compact BGA packaging: 676-FBGA (27×27) enables dense board-level integration while maintaining high pin count.

Why Choose M2GL060T-1FG676I?

The M2GL060T-1FG676I balances substantial logic capacity, embedded memory, and a large I/O complement in a compact 676-FBGA package. Its industrial temperature rating and flexible supply voltage range make it suitable for engineers designing resilient, high-density digital systems that require on-chip resources without excessive external components.

This FPGA is a fit for development teams and procurement focused on industrial-grade board-level implementations that demand scalable logic resources, ample embedded RAM, and extensive I/O in a RoHS-compliant package.

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