M2GL060T-1FG676

The M2GL060T-1FG676 is an IGLOO2 field programmable gate array (FPGA) from Microchip Technology, offered in a 676-FBGA (27×27) surface-mount package. It provides a high-density, commercially graded programmable logic device for embedded and commercial applications.

With 56,520 logic elements, approximately 1.87 Mbits of embedded memory and 387 general-purpose I/O, this device targets designs that require substantial on-chip logic and memory capacity within a single-package FPGA. It supports a supply voltage range of 1.14 V to 2.625 V and operates across a 0 °C to 85 °C temperature range.

Key Features

• Core Logic 56,520 logic elements provide significant on-chip programmable logic resources for implementing complex digital functions.
• Embedded Memory Approximately 1.87 Mbits of total on-chip RAM for buffering, state storage and small data structures.
• I/O Capacity 387 I/O pins accommodate multiple interfaces and peripheral connections in a single device footprint.
• Power / Voltage Flexible supply voltage range from 1.14 V to 2.625 V to match a variety of power-domain architectures.
• Package & Mounting 676-FBGA (27×27) package in a surface-mount form factor for high-density board-level integration.
• Commercial Grade & Temperature Range Specified for commercial applications with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance RoHS compliant for adherence to common environmental and manufacturing requirements.

Typical Applications

• Embedded Control Systems Implement control logic, state machines and glue logic in commercial embedded products requiring on-chip programmability.
• Interface and Protocol Bridging Use the device's high I/O count to connect and translate between multiple peripheral interfaces and buses.
• Data Buffering and Processing Leverage the on-chip RAM and logic elements for local data staging, pre-processing, and FIFO implementations.
• Prototyping and System Validation Provide a configurable platform for validating digital designs and performing iterative hardware development.

Unique Advantages

• High Logic Density: 56,520 logic elements enable complex logic implementations without immediately moving to larger multi-chip solutions.
• Substantial On-Chip Memory: Approximately 1.87 Mbits of embedded RAM supports buffering and temporary data storage directly on the device.
• Generous I/O Count: 387 I/Os reduce the need for external multiplexing or additional devices when interfacing multiple peripherals.
• Flexible Power Integration: Wide supply voltage range (1.14 V–2.625 V) supports integration into varied board power architectures.
• Compact, High-Density Package: 676-FBGA (27×27) surface-mount packaging enables dense board layouts while keeping signals localized.
• Commercial-Grade Availability: Specified for commercial-temperature operation and RoHS compliant for mainstream product manufacturing.

Why Choose M2GL060T-1FG676?

The M2GL060T-1FG676 positions itself as a high-capacity, commercially graded FPGA solution for designers who need a balance of logic density, on-chip memory and extensive I/O in a single, compact package. Its combination of 56,520 logic elements, approximately 1.87 Mbits of embedded RAM and 387 I/Os supports a broad set of embedded and interface-focused designs.

Engineers developing commercial embedded systems, interface bridges, data buffering modules or prototype platforms will find this IGLOO2 device suitable for reducing board-level complexity while maintaining flexibility. Backed by Microchip Technology, it offers a programmable hardware option for scalable designs within the specified commercial temperature and voltage ranges.

Request a quote or submit an inquiry today to receive pricing and availability information for the M2GL060T-1FG676.