M2GL060T-1FG484I
| Part Description |
IGLOO2 Field Programmable Gate Array (FPGA) IC 267 1869824 56520 484-BGA |
|---|---|
| Quantity | 725 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 10 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 267 | Voltage | 1.14 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 56520 | Number of Logic Elements/Cells | 56520 | ||
| Number of Gates | N/A | ECCN | 3A991B2 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1869824 |
Overview of M2GL060T-1FG484I – IGLOO2 FPGA, 56,520 logic elements, 484‑BGA
The M2GL060T-1FG484I is an IGLOO2 Field Programmable Gate Array (FPGA) supplied in a 484‑BGA package. It provides a large programmable fabric with a significant on‑chip memory complement and a high I/O count for compact, industrial applications.
Designed for embedded and industrial designs, this device combines 56,520 logic elements, approximately 1.87 Mbits of embedded memory, and 267 I/O pins with a wide supply voltage range and an industrial temperature rating for reliable operation in demanding environments.
Key Features
- Core Logic 56,520 logic elements (cells) provide substantial programmable capacity for custom logic, state machines, and control functions.
- Embedded Memory Approximately 1.87 Mbits of on‑chip RAM to support buffering, lookup tables, and small data stores without external memory.
- I/O Capability 267 user I/O pins support dense peripheral and signal interfacing in a single package.
- Power and Supply Operates across a wide supply range from 1.14 V to 2.625 V to accommodate various I/O and core voltage requirements.
- Package & Mounting 484‑BGA package (supplier package: 484‑FPBGA, 23×23) with surface‑mount mounting for space‑efficient board layouts.
- Temperature & Grade Industrial grade with an operating temperature range of −40 °C to 100 °C, suitable for extended temperature applications.
- Environmental Compliance RoHS compliant.
Typical Applications
- Industrial Control Systems Programmable logic and I/O aggregation for machinery control, leveraging the industrial temperature range and high I/O count.
- Embedded Processing Custom embedded datapaths and control logic that benefit from a large logic fabric and on‑chip RAM.
- Communications and Interface Bridging Protocol adaptation and interface consolidation using abundant I/O and flexible voltage support.
- Signal Aggregation and Preprocessing Local data buffering and preprocessing where on‑chip memory and programmable logic reduce external component needs.
Unique Advantages
- Highly integrated solution: Combines 56,520 logic elements and approximately 1.87 Mbits of embedded memory to reduce external components and simplify designs.
- High I/O density: 267 I/O pins allow consolidation of multiple peripherals and interfaces into a single device footprint.
- Wide supply range: Support for 1.14 V to 2.625 V operation enables flexible interfacing with different voltage domains.
- Industrial robustness: Rated for −40 °C to 100 °C operation, providing suitability for extended temperature environments.
- Compact assembly: 484‑BGA surface‑mount package (484‑FPBGA, 23×23) helps minimize board area while preserving connectivity.
- Regulatory compliance: RoHS compliance supports environmentally conscious product design and manufacturing.
Why Choose M2GL060T-1FG484I?
The M2GL060T-1FG484I positions itself as a robust, high‑capacity FPGA option for engineers who need substantial programmable logic, embedded memory, and a large number of I/O signals in a compact, industrial‑rated package. Its combination of logic resources, on‑chip RAM and flexible voltage operation makes it well suited to embedded systems that require integration and resilience across temperature extremes.
For designs that demand scalability and reduced bill‑of‑materials through integration, this IGLOO2 device offers a balance of capacity and practical system‑level features that support long‑term deployment in industrial and embedded applications.
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