M2GL060T-1FCSG325

The M2GL060T-1FCSG325 is an IGLOO2-series Field Programmable Gate Array (FPGA) in a 325-TFBGA surface-mount package. It provides a balanced combination of logic capacity, embedded memory, and I/O count for commercial embedded designs.

With 56,520 logic elements, approximately 1.87 Mbits of embedded memory and up to 200 I/O, this device targets commercial applications where moderate logic density, compact packaging, and low-voltage operation are required.

Key Features

• Core Logic 56,520 logic elements provide substantial configurable logic capacity for a wide range of custom digital functions.
• Embedded Memory Approximately 1.87 Mbits of on-chip RAM for buffering, state storage, and small-data processing tasks.
• I/O Count Up to 200 general-purpose I/O pins to support multiple external interfaces and peripherals.
• Power and Voltage Operates from a 1.14 V to 2.625 V supply range to accommodate a variety of low-voltage system designs.
• Package and Mounting 325-TFBGA (supplier package 325-FCBGA, 11×11) in a surface-mount form factor for compact PCB implementation.
• Operating Conditions Commercial grade operation from 0 °C to 85 °C for general-purpose commercial products.
• Regulatory RoHS-compliant manufacturing to support environmentally conscious product design.

Typical Applications

• Commercial Embedded Systems — Provides configurable logic and on-chip RAM for control, signal processing, and glue-logic tasks in commercial products.
• I/O-Intensive Interfaces — With 200 I/O pins, suitable for designs that require multiple parallel interfaces or densely connected peripherals.
• Compact, Surface-Mount Designs — The 325-TFBGA package and surface-mount mounting enable space-constrained PCB layouts.
• Low-Voltage Designs — The 1.14 V to 2.625 V supply range supports systems designed around lower supply rails.

Unique Advantages

• Substantial Logic Capacity: 56,520 logic elements allow implementation of complex custom logic without external CPLDs or discrete logic.
• Integrated Memory: Approximately 1.87 Mbits of embedded RAM reduces the need for external memory in many applications, simplifying BOM and board routing.
• High I/O Density: 200 I/O pins support extensive peripheral connectivity and flexible interface mapping.
• Compact, Surface-Mount Package: The 325-TFBGA (11×11) package supports high-density board designs and automated assembly processes.
• Commercial Temperature Range: Rated 0 °C to 85 °C for a wide range of commercial product use cases.
• RoHS Compliant: Environmentally compliant manufacturing supports regulatory requirements for many markets.

Why Choose M2GL060T-1FCSG325?

The M2GL060T-1FCSG325 IGLOO2 FPGA delivers a practical balance of logic resources, embedded memory, and I/O capability in a compact surface-mount 325-TFBGA package. Its low-voltage operation and commercial temperature rating make it well suited for a variety of commercial embedded system designs that require configurable logic and moderate on-chip memory.

Design teams seeking a scalable, RoHS-compliant FPGA solution for compact boards and I/O-rich applications will find this device provides a clear integration advantage while streamlining BOM and PCB layout considerations.

Request a quote or submit an inquiry to receive pricing and availability for the M2GL060T-1FCSG325. Our team can provide lead-time information and support for your design planning needs.