M2GL060T-1FCS325I
| Part Description |
IGLOO2 Field Programmable Gate Array (FPGA) IC 200 1869824 56520 325-TFBGA, FCBGA |
|---|---|
| Quantity | 1,487 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 10 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 325-FCBGA (11x11) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 325-TFBGA, FCBGA | Number of I/O | 200 | Voltage | 1.14 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 56520 | Number of Logic Elements/Cells | 56520 | ||
| Number of Gates | N/A | ECCN | 3A991B2 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1869824 |
Overview of M2GL060T-1FCS325I – IGLOO2 Field Programmable Gate Array (FPGA), 200 I/O, 56520 logic elements
The M2GL060T-1FCS325I is an IGLOO2 Field Programmable Gate Array (FPGA) IC from Microchip Technology. It integrates 56,520 logic elements and approximately 1.87 Mbits of embedded RAM while providing up to 200 I/O in a compact 325-TFBGA / 325-FCBGA (11×11) surface-mount package.
Designed for industrial environments, the device supports a supply voltage range of 1.14 V to 2.625 V and an operating temperature range from −40 °C to 100 °C. The part is RoHS compliant for environmental compatibility.
Key Features
- Core Logic 56,520 logic elements (cells) suitable for mid‑density FPGA designs.
- Embedded Memory Approximately 1.87 Mbits of on-chip RAM to support data buffering, state storage, and memory-intensive logic.
- I/O Capacity Up to 200 general-purpose I/O pins to accommodate multiple interfaces and peripheral connections.
- Power Flexible supply-voltage range from 1.14 V to 2.625 V to match a variety of system power domains.
- Package & Mounting Available in a 325-TFBGA / 325-FCBGA format (supplier device package: 325-FCBGA 11×11); surface-mount design for compact PCB integration.
- Temperature & Compliance Industrial-grade operating range of −40 °C to 100 °C and RoHS compliance for broad deployment.
Unique Advantages
- High logic density: 56,520 logic elements enable implementation of complex digital functions without external glue logic.
- On-chip memory: Approximately 1.87 Mbits of embedded RAM reduces the need for external memory and simplifies board layouts.
- Generous I/O count: 200 I/O pins provide flexibility for interfacing multiple sensors, peripherals, or bus standards.
- Wide supply compatibility: 1.14 V to 2.625 V supply range allows integration with a variety of system power architectures.
- Industrial readiness: Rated for −40 °C to 100 °C operation to meet demanding environmental conditions.
- Compact BGA package: 325-TFBGA / 325-FCBGA (11×11) surface-mount package supports space-constrained designs while maintaining signal density.
Why Choose M2GL060T-1FCS325I?
The M2GL060T-1FCS325I brings together a substantial logic element count, meaningful embedded memory, and a high I/O complement in a compact industrial-grade BGA package from Microchip Technology. Its supply-voltage flexibility and wide operating-temperature range make it suitable for systems that require reliable, mid-density programmable logic in constrained form factors.
This device is a practical option for designers seeking a balanced combination of logic resources, on-chip memory, and I/O capability with RoHS compliance and surface-mount packaging for modern PCB assembly flows.
Request a quote or submit an inquiry to receive pricing and availability for the M2GL060T-1FCS325I.
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