M2GL060T-1FCSG325I
| Part Description |
IGLOO2 Field Programmable Gate Array (FPGA) IC 200 1869824 56520 325-TFBGA, FCBGA |
|---|---|
| Quantity | 1,463 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 10 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 325-FCBGA (11x11) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 325-TFBGA, FCBGA | Number of I/O | 200 | Voltage | 1.14 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 56520 | Number of Logic Elements/Cells | 56520 | ||
| Number of Gates | N/A | ECCN | 3A991B2 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1869824 |
Overview of M2GL060T-1FCSG325I – IGLOO2 Field Programmable Gate Array (FPGA) IC 200 1869824 56520 325-TFBGA, FCBGA
The M2GL060T-1FCSG325I is an IGLOO2 Field Programmable Gate Array (FPGA) from Microchip Technology. This industrial-grade FPGA integrates 56,520 logic elements, approximately 1.87 Mbits of on-chip RAM, and up to 200 I/O connections in a surface-mount 325-TFBGA / 325-FCBGA (11×11) package.
With a supply voltage range of 1.14 V to 2.625 V and an operating temperature range of −40 °C to 100 °C, the device targets embedded and industrial designs that require substantial logic capacity, embedded memory, and robust environmental tolerance.
Key Features
- Core / Logic 56,520 logic elements for implementing complex programmable logic and control functions.
- Embedded Memory Approximately 1.87 Mbits of on-chip RAM (1,869,824 bits) to support buffering, state storage, and data handling without external memory.
- I/O 200 available I/O pins to connect sensors, actuators, peripheral devices, and external interfaces directly.
- Power Wide supply voltage range from 1.14 V to 2.625 V to accommodate multiple power-rail architectures and signaling levels.
- Package & Mounting 325-TFBGA / 325-FCBGA (11×11) supplier device package in a surface-mount format for compact PCB implementations.
- Temperature Range & Grade Industrial-grade device with specified operation from −40 °C to 100 °C for harsher environments.
- Compliance RoHS compliant.
Typical Applications
- Industrial control Programmable logic and I/O integration for automation, motor control, and machine interface functions within industrial temperature ranges.
- Embedded processing & custom logic On-chip logic elements and embedded RAM enable implementation of custom accelerators, protocol handlers, and system glue logic.
- I/O-dense systems High I/O count supports systems that require many direct sensor, actuator, or peripheral connections.
- Low-voltage and power-aware designs Flexible supply range allows integration into designs with nonstandard or multi-rail power architectures.
Unique Advantages
- High logic capacity: 56,520 logic elements provide headroom for large custom logic implementations without immediate need for external FPGAs or CPLDs.
- Substantial on-chip memory: Approximately 1.87 Mbits of embedded RAM reduces dependence on external memory for buffering and state retention.
- Extensive connectivity: 200 I/Os enable direct interfacing to a wide range of peripherals and sensors, simplifying board-level design.
- Broad supply compatibility: 1.14 V to 2.625 V operation supports diverse power schemes and signaling levels common in embedded systems.
- Industrial temperature rating: Specified operation from −40 °C to 100 °C addresses deployment in demanding environmental conditions.
- Compact surface-mount package: 325-FCBGA (11×11) package supports dense PCB layouts and space-constrained applications.
Why Choose M2GL060T-1FCSG325I?
The M2GL060T-1FCSG325I delivers a balance of logic capacity, embedded memory, and I/O density in an industrial-grade FPGA from Microchip Technology. Its combination of 56,520 logic elements, approximately 1.87 Mbits of RAM, and 200 I/Os in a compact surface-mount package makes it well suited for embedded and industrial designs that require robust operation across a wide temperature range and flexible power options.
Choose this device when you need programmable logic density, on-chip memory, and extensive connectivity in a RoHS-compliant FPGA package designed for industrial environments.
Request a quote or submit an inquiry for pricing and availability of the M2GL060T-1FCSG325I to begin integrating this IGLOO2 FPGA into your design.

Date Founded: 1989
Headquarters: Chandler, Arizona, USA
Employees: 22,000+
Revenue: $8.349 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016, AS 9100D