M2GL060T-1FCS325

The M2GL060T-1FCS325 is an IGLOO2 Field Programmable Gate Array (FPGA) from Microchip Technology delivering programmable logic capacity with embedded memory and a high I/O count in a compact BGA package. It is designed for applications that require a significant number of logic elements, on-chip RAM, and flexible I/O in a commercial-grade surface-mount form factor.

Key attributes include 56,520 logic elements, approximately 1.87 Mbits of embedded memory, and 200 I/O pins, making this device suitable for designs that need substantial programmable logic and memory resources within a 325-ball FCBGA footprint.

Key Features

• Logic Capacity  56,520 logic elements provide substantial programmable logic resources for complex digital functions.
• Embedded Memory  Approximately 1.87 Mbits of on-chip RAM to support buffering, state machines, and data storage close to logic.
• I/O  200 user I/O pins to accommodate multiple external interfaces and parallel connections.
• Power  Flexible supply voltage range from 1.14 V to 2.625 V to support a range of power-architecture choices.
• Package and Mounting  Supplied in a 325-TFBGA (325-FCBGA, 11×11) package for surface-mount assembly and compact board integration.
• Operating Range  Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Compliance  RoHS compliant, meeting common environmental requirements for electronic assemblies.

Typical Applications

• Logic-dense embedded designs — Implement complex state machines, data processing pipelines, or protocol handling using the device’s 56,520 logic elements and embedded RAM.
• I/O-intensive interfaces — Support multiple parallel or serialized connections with 200 available I/O pins for interfacing to sensors, peripherals, or custom buses.
• Compact board integration — Use the 325-FCBGA (11×11) package where board space is constrained but programmable logic capacity is required.

Unique Advantages

• High programmable logic density: 56,520 logic elements reduce the need for multiple devices in logic-heavy designs.
• On-chip memory proximity: Approximately 1.87 Mbits of embedded RAM enables efficient data handling and lower-latency storage close to logic functions.
• Generous I/O count: 200 I/O pins simplify integration with multiple peripherals and external systems without extensive multiplexing.
• Compact BGA package: 325-FCBGA (11×11) offers a space-efficient solution for surface-mount assemblies.
• Flexible power options: The 1.14 V to 2.625 V supply range supports varied power-domain architectures and optimization.
• Commercial-grade reliability: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial applications.

Why Choose M2GL060T-1FCS325?

The M2GL060T-1FCS325 positions itself as a commercial-grade IGLOO2 FPGA offering a balanced combination of substantial logic capacity, embedded memory, and a high I/O count in a compact 325-ball FCBGA package. It is well suited to engineers and procurement teams seeking a programmable solution for designs that demand significant on-chip resources without enlarging PCB footprint.

With explicit power-supply flexibility, a clear operating temperature range, and RoHS compliance, this device provides a verifiable specification set that supports stable integration into commercial electronic products. The combination of logic density, memory, and I/O makes it a practical choice where reprogrammable logic and on-chip memory are required.

Request a quote or submit an inquiry to obtain pricing and availability for M2GL060T-1FCS325.