M7A3P1000-1FG256

The M7A3P1000-1FG256 is a ProASIC3 field programmable gate array designed for commercial electronic applications. It delivers a high logic density architecture with 1,000,000 gates and 24,576 logic elements in a compact 256-LBGA package.

With 177 user I/O, approximately 0.147 Mbits of embedded memory and a defined core supply range of 1.425 V to 1.575 V, this device targets commercial embedded designs that require significant programmable logic, moderate on-chip RAM and a high I/O count within a surface-mount, RoHS-compliant package.

Key Features

• Core Logic  Up to 1,000,000 gates implemented as 24,576 logic elements to support complex programmable logic and glue-logic functions.
• Embedded Memory  Approximately 0.147 Mbits of on-chip RAM for buffering, small data storage and state retention within logic designs.
• I/O Capacity  177 user I/O pins to support multiple parallel interfaces, signal routing and mixed-signal interfacing in board-level designs.
• Power  Specified core voltage range of 1.425 V to 1.575 V for consistent device operation within validated supply limits.
• Package and Mounting  256-LBGA (supplier package: 256-FPBGA, 17×17) in a surface-mount form factor for high-density PCB implementations.
• Operating Range  Commercial-grade operation from 0 °C to 85 °C to match typical commercial electronics temperature requirements.
• Standards Compliance  RoHS-compliant construction for regulatory and environmental conformity in commercial product assemblies.

Typical Applications

• Commercial Embedded Systems  High logic density and substantial I/O count make the device suitable for commercial embedded controllers and programmable subsystems.
• Interface and I/O Expansion  Use the 177 I/O pins to bridge multiple interfaces and implement custom peripheral logic on space-constrained PCBs.
• Signal Processing and Control  Combines large logic element count with on-chip RAM for implementing custom control, sequencing and moderate buffering tasks.
• Prototyping and Evaluation  A compact LBGA package and commercial temperature rating support board-level evaluation and prototype builds for product development.

Unique Advantages

• High Logic Density: 1,000,000 gates and 24,576 logic elements enable consolidation of complex logic into a single device, reducing BOM count.
• Generous I/O: 177 user I/O pins allow flexible interface mapping and extensive connectivity without additional bridge devices.
• Compact Surface-Mount Package: 256-LBGA (256-FPBGA, 17×17) supports high-density board layouts while maintaining a robust mounting style.
• Controlled Core Supply: Narrow 1.425 V–1.575 V supply window supports predictable core behaviour across compliant power systems.
• Commercial Temperature Rating: Qualified for 0 °C–85 °C operation to meet common commercial deployment environments.
• RoHS Compliance: Environmentally compliant construction supports contemporary assembly and regulatory requirements.

Why Choose M7A3P1000-1FG256?

The M7A3P1000-1FG256 strikes a balance between high logic capacity and practical board-level integration. Its combination of 1,000,000 gates, 24,576 logic elements, approximately 0.147 Mbits of embedded RAM and 177 I/O in a 256-LBGA package provides a compact, programmable platform for commercial designs that require substantial on-chip logic and connectivity.

This device is well suited to engineers developing commercial embedded systems, interface controllers and FPGA-based prototypes who need predictable supply requirements, a high I/O count and RoHS-compliant packaging for modern product assemblies.

Request a quote or contact sales to check availability and pricing for M7A3P1000-1FG256 and to discuss how it fits your commercial design requirements.