M7A3P1000-1FG484

The M7A3P1000-1FG484 is a ProASIC3 Field Programmable Gate Array (FPGA) IC offering a high density of programmable logic and on-chip memory in a compact 484-ball BGA package. It provides 24,576 logic elements (LEs), approximately 0.147 Mbits of embedded RAM, and up to 300 user I/O pins, making it suitable for designs that require substantial logic capacity and flexible I/O density.

This device is supplied for commercial-grade applications and operates from a single supply range of 1.425 V to 1.575 V with an operating temperature range of 0 °C to 85 °C, and is offered in a surface-mount 484-FPBGA (23×23) package.

Key Features

• Logic Capacity — 24,576 logic elements supporting up to 1,000,000 logical gates for complex digital designs and implementation of high-density logic functions.
• Embedded Memory — Approximately 0.147 Mbits of total on-chip RAM available for data buffering, state machines, and small lookup tables.
• I/O Density — 300 user I/O pins to support diverse peripheral interfaces and multiple signal domains.
• Power Supply — Single supply voltage range of 1.425 V to 1.575 V to match system power rails and simplify power architecture.
• Package and Mounting — 484-ball FPBGA (23×23) surface-mount package (484-BGA) for high pin count in a compact footprint.
• Operating Conditions — Commercial-grade operating temperature from 0 °C to 85 °C for standard commercial environments.
• RoHS Compliance — Device is RoHS compliant for environmentally conscious manufacturing and assembly.

Typical Applications

• Embedded system logic — Implement control logic, protocol handlers, and data-path functions using the device's 24,576 logic elements and embedded RAM.
• I/O expansion and bridging — Use the 300 I/O pins to interface multiple peripherals, buses, or mixed-voltage interfaces in a compact package.
• Prototyping and evaluation — Rapidly map and iterate digital designs that require substantial gate counts and flexible I/O while maintaining a compact board footprint.

Unique Advantages

• High logic density: 24,576 logic elements and 1,000,000 gates enable implementation of complex logic functions without external glue logic.
• Compact, high-pin-count package: The 484-FPBGA (23×23) package provides 300 user I/Os in a small area, optimizing board space for dense designs.
• Integrated on-chip RAM: Approximately 0.147 Mbits of embedded memory reduces the need for external RAM for small buffers and state storage.
• Single-supply operation: A defined supply window of 1.425 V to 1.575 V simplifies power sequencing and integration with common system rails.
• Commercial availability: Designed and specified for commercial-temperature operation (0 °C to 85 °C) and RoHS-compliant manufacturing.

Why Choose M7A3P1000-1FG484?

The M7A3P1000-1FG484 positions itself as a high-density, commercially rated FPGA option within the ProASIC3 family that balances significant logic capacity, embedded memory, and extensive I/O in a single 484-BGA package. Its specifications suit engineers designing systems that need substantial programmable logic and flexible interfacing while keeping board space and component count under control.

This device is appropriate for development teams and OEMs seeking a scalable FPGA resource for applications that operate within commercial temperature ranges and standard supply rails, delivering a combination of integration and predictable electrical and thermal characteristics.

Request a quote for the M7A3P1000-1FG484 or submit a purchase inquiry to receive pricing and availability information.