M7A3P1000-1FGG256

The M7A3P1000-1FGG256 is a ProASIC3 Field Programmable Gate Array (FPGA) from Microchip Technology intended for commercial embedded applications requiring reconfigurable logic. It combines up to 1,000,000 gates and 24,576 logic elements with on-chip embedded memory and a broad I/O count for flexible system integration.

This surface-mount 256-LBGA device supports a 1.425 V to 1.575 V core supply and operates across a commercial temperature range of 0 °C to 85 °C, making it suitable for a range of commercial designs that need medium-density programmable logic and significant I/O connectivity.

Key Features

• Core Logic Provides 24,576 logic elements (equivalent to 1,000,000 gates) for implementing custom digital functions, state machines, and glue logic.
• Embedded Memory Includes 147,456 bits of on-chip RAM—approximately 0.15 Mbits of embedded memory—for data buffering and small lookup tables.
• I/O Capability 177 user I/O pins enable interfacing to a wide range of peripherals, sensors, and external devices.
• Package & Mounting Available in a compact 256-LBGA package (supplier device package: 256-FPBGA 17×17) designed for surface-mount assembly on modern PCBs.
• Power Requires a core supply voltage in the range of 1.425 V to 1.575 V for predictable integration into multi-rail designs.
• Operating Range & Grade Commercial-grade device rated for 0 °C to 85 °C operation and compliant with RoHS environmental requirements.

Typical Applications

• Commercial Embedded Systems — Implement custom logic, protocol bridging, or control functions where up to 24,576 logic elements and 177 I/Os are required.
• Communication Equipment (Commercial) — Use for packet processing, peripheral interfacing, or timing control in commercial networking and telecommunications gear.
• Test & Measurement — Provide configurable signal processing, data aggregation, and control logic for bench and field instruments.
• Consumer and Industrial-Control Electronics — Integrate user interfaces, sensor aggregation, and custom peripherals in commercial products operating within the specified temperature range.

Unique Advantages

• High Logic Capacity: 24,576 logic elements and 1,000,000 gates enable medium-density designs without external CPLDs or FPGAs.
• Substantial I/O Count: 177 I/O pins simplify direct connections to sensors, displays, and external devices, reducing the need for expansion hardware.
• On-Chip Memory: Approximately 0.15 Mbits of embedded RAM supports buffering and small data structures directly on the FPGA fabric.
• Compact, Assembly-Friendly Package: 256-LBGA (256-FPBGA 17×17) provides a small footprint for space-constrained boards while supporting surface-mount manufacturing.
• Predictable Power Requirements: Narrow core voltage range (1.425 V–1.575 V) eases power-supply planning and integration.
• Compliance and Grade: Commercial temperature rating (0 °C–85 °C) and RoHS compliance align with typical commercial product requirements.

Why Choose M7A3P1000-1FGG256?

The M7A3P1000-1FGG256 balances logic density, I/O flexibility, and on-chip memory in a compact LBGA package, making it a practical choice for commercial embedded designs that require reconfigurable logic without excessive board real estate. As a member of the ProASIC3 family from Microchip Technology, it provides a clear, specification-driven option for teams focused on reliable medium-density FPGA integration.

This device suits designers and product teams building commercial equipment—prototyping or production—who need a predictable supply voltage, substantial I/O, and on-chip memory in a RoHS-compliant, surface-mount package.

Request a quote or submit an inquiry for pricing and availability to begin evaluation of the M7A3P1000-1FGG256 for your next commercial FPGA design.