M7A3P1000-1FGG484

The M7A3P1000-1FGG484 is a ProASIC3 field programmable gate array (FPGA) IC from Microchip Technology, provided in a 484-ball BGA package. It delivers a commercial-grade programmable logic solution with 24,576 logic elements and a one-million-gate capacity for medium-complexity digital designs.

With 300 user I/O pins, 147,456 bits of on-chip RAM (approximately 0.15 Mbits), and a defined core supply range of 1.425 V to 1.575 V, this device is targeted at commercial applications that require substantial logic density, flexible I/O and a compact BGA footprint.

Key Features

• Core Logic  24,576 logic elements (cells) providing around one million equivalent gates for implementing medium-complexity digital functions.
• Embedded Memory  147,456 bits of on-chip RAM (approximately 0.15 Mbits) to support buffering, state storage and small LUT-based data structures.
• I/O Density  300 user I/O pins to accommodate parallel interfaces, bus connections and multiple peripheral signals.
• Power Supply  Defined core voltage supply range of 1.425 V to 1.575 V to meet system power-rail requirements.
• Package & Mounting  484-FPBGA (23 × 23 mm) package, 484-BGA case, designed for surface-mount assembly in compact board layouts.
• Temperature & Grade  Commercial-grade device specified for operation from 0 °C to 85 °C.
• Compliance  RoHS compliant, supporting regulatory requirements for lead-free assembly and materials.

Typical Applications

• Commercial Embedded Systems  Implement custom logic, glue-logic and peripheral aggregation in space-constrained commercial electronic products.
• Communications and Networking  Provide moderate-density I/O and programmable logic for packet processing, interface bridging and protocol adaptation in commercial networking equipment.
• High-Density I/O Modules  Serve as the programmable logic element in modules that require many parallel I/O lines and compact BGA packaging.

Unique Advantages

• Substantial Logic Capacity: 24,576 logic elements and one million gates allow implementation of significant custom digital functions without external ASICs.
• Integrated On-Chip RAM: 147,456 bits (~0.15 Mbits) of embedded memory reduce the need for external RAM for small buffers and state machines.
• High I/O Count: 300 user I/O pins support multi-channel interfaces and complex board-level interconnects.
• Compact BGA Package: 484-FPBGA (23×23) enables a high-density implementation while keeping PCB area requirements low.
• Predictable Power Rail: A specified core voltage window (1.425–1.575 V) simplifies power-supply design and integration.
• RoHS Compliant: Conforms to lead-free manufacturing requirements for compliant product assemblies.

Why Choose M7A3P1000-1FGG484?

The M7A3P1000-1FGG484 positions itself as a commercial-grade ProASIC3 FPGA option for designers needing a balance of logic density, on-chip memory and a high count of I/O in a compact BGA package. Its specified electrical and environmental parameters make it suitable for board-level integration where predictable power rails and commercial temperature operation are required.

This device is well suited to engineering teams developing mid-complexity programmable logic solutions that benefit from a single-chip implementation of control, glue logic and I/O aggregation, while maintaining compliance with RoHS assembly requirements.

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